Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

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Expert Details

CMOS/CCD Image Sensor and Analog Design

ID: 727021 Israel

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Expert experience covers all aspects Image Sensors development from concept, device and process development to transition into productization.

Since he was involved in all aspects of camera development, he can contribute and complement the firm's team in detailed development of firm's camera and analog products.

The benefit of Expert as a CMOS Image Sensor Device and Analog Design Expert person includes:
1. Detailed technical knowledge of all aspects of CMOS Image Sensors and associated Analog Integrated Circuit Design comprising:
a. System specifications
b. Flow down specifications to the pixel and circuitry levels
c. Pixel circuit and layout design and CMOS Analog Design
d. Process flow
e. Electrical and optical testing and verification
2. A senior person who has worked both at a semiconductor fab foundry (Tower) and application oriented company (3DV Systems – now Microsoft). He understand all aspects of technical and administrative issues and procedures.
3. On-site negotiator for specs, delivery times and pricing


1.Design of VLSI CMOS signal processor chip for IR detector interface comprising low noise, low power buffered direct injection input opamp, integrator, voltage and current limiters, buffer amplifier, multiplexer readout circuitry and sample/hold circuits. Complete vertical design from system concept specifications through circuit design mask layout and tape out.
2.Develop Spice DC and Noise Characterization and modeling system including hardware for measuring and software for analysis. Initiated and implemented Vertical CAD Design System for VLSI circuit design including defining software and hardware products

Education

Year Degree Subject Institution
Year: 1975 Degree: PhD Subject: Electrical Engineering and Applied Physics Institution: Case Western Reserve University
Year: 1971 Degree: M.S. Subject: Electrical Engineering Institution: Technion-Israel Institute of Technology
Year: 1968 Degree: B.S. Subject: Electrical Engineering Institution: Case Western Reserve University

Work History

Years Employer Title Department
Years: 2005 to 2008 Employer: 3DV Systems LTD (now Microsoft) Title: CMOS Image Sensor Analog Design Manager Department: VLSI Group
Responsibilities:
1. Developed a unique video imaging technology and camera for sensing distance in real-time between an imaging sensor and objects at high speed and high resolution mainly for gaming and computer interface applications
CMOS Image Sensor and Analog Design ManagerMajor Responsibilities:
1. Developing small pixels and analog signal processing for a novel 3D all CMOS based Image Sensor for commercial applications. The concept is based on the Time-of-Flight (TOF) principle in the Near Infrared spectral region using innovating photon gating techniques The basic feature incorporates real- time depth imaging by capturing the shape of a light-pulse front as it is reflected from a three dimensional object.
2. Pixel device and process development employing TCAD tools·
3.Pixel physical design development and characterization using Cadence Virtuoso·
4. Analog design employing Cadence Analog Artist and Spectre simulation
Years Employer Title Department
Years: 2004 to 2005 Employer: BlueBird Optical Mems LTD Title: CMOS Image Sensor VLSI Design Manager Department: VLSI Group
Responsibilities:
1. TDI Camera Design and Conceptual
2. 3D Camera Development
Years Employer Title Department
Years: 2000 to 2004 Employer: Tower Semiconductor Title: CMOS Image Sensor & Analog Device Section Head Department: Image Sensor Group
Responsibilities:
1. CMOS Image Sensor Pixel development of various photodetectors (Pinned Photo Diode) and pixel designs, analog circuit design, process development and characterization of 3-4 transistor pixels. The pixel sizes ranged from 5.6um to 2.7um on a side. (simulation and layout), electrical and optical characterization for 0.18u and 0.35u processes
2. Process development including process simulation for unique photodiode process including spectral response, uniformity and dark current requirements·
3. Fully Flexible Open Architecture Characterization Vehicle Development·
4. Analog test vehicle development including CMOS, resistor, capacitor, bipolar matching: temperature, voltage and matching characterization for various process and layout configurations·
5. Analog circuit (BG Ref, ADC, Ring Oscillator and CBCM) simulation and characterization to verify component spice models
Years Employer Title Department
Years: 1989 to 2000 Employer: SCD - Semiconductor Devices Title: Senior Staff - VLSI Design Group & Project Management Department:
Responsibilities:
1.Design of VLSI CMOS signal processor chip for IR detector interface comprising low noise, low power buffered direct injection input opamp, integrator, voltage and current limiters, buffer amplifier, multiplexer readout circuitry and sample/hold circuits. Complete vertical design from system concept specifications through circuit design mask layout and tape out.
2.Develop Spice DC and Noise Characterization and modeling system including hardware for measuring and software for analysis. Initiated and implemented Vertical CAD Design System for VLSI circuit design including defining software and hardware products
3.Project Management including coordinating development of IR detector and performing detector and optical design
Years Employer Title Department
Years: 1987 to 1989 Employer: Rockwell International: Title: Manager - Device Engineering Group (25 engineers and scientists) Department: Electro - Optical Center
Responsibilities:
A. CAD strategy planning and development·
B. VLSI circuit design for Focal Plane Arrays·
C. Device characterization·
D Project management
1.Initiated and successfully implemented Vertical CAD Design System for VLSI circuit design including defining software and hardware products
2.Reduced design time and cost by a factor of 2 by optimizing resources comprising of personnel and optimizing CAD implementation
3.Project management including readout and multiplexer VLSI CMOS circuit design.
Years Employer Title Department
Years: 1980 to 1987 Employer: Rafael - Armament Development Authority Title: Manager - Device Processing Technology Section (18 engineers & technicians) Department: SemiConductor Device Department
Responsibilities:
1. Successfully directed the process development, implementation and transfer to production of numerous infrared detector array programs. Specifically: device design, photolithography, material characterization, etching, chemical and vapor depositions, process development and optimization. 2. Developed, implemented and transfer to production planar process of IR detectors from prior mesa process, thereby increasing yield significantly and providing a roadmap to the fabrication of large matrix photodetector arrays.
Years Employer Title Department
Years: 1978 to 1980 Employer: Rockwell International, Anaheim California Title: Manager - Device Development Group (15 engineers) Department: Focal Plane Development Department
Responsibilities:
A. Infrared and visible CCD imaging multiplexer design
B. Process development and characterization.
1.Successfully managed numerous multiplexer and readout projects.
2.Developed CCD double polysilicon process using LOCOS process, thereby increasing yield and throughput.
Years Employer Title Department
Years: 1975 to 1978 Employer: Hughes Aircraft Co., Newport Beach, CA Title: Senior Member of Technical Staff Department: Microelectronics Research Center
Responsibilities:
1. High density CCD Memory array design, process development and testing.
2. 65k Memory:Device and architecture design including CAD layout, device simulation and mask procurement

Government Experience

Years Agency Role Description
Years: 1987 to 1989 Agency: DARPA Role: Image Sensor Design Description: Manager of Device Engineering group at Rockwell International Electro-Optics Dept, Developing Infrared Image Sensors with readout electronics
Years: 1978 to 1980 Agency: DARPA Role: Readout electronics design for infrared sensors Description: Manager of Device Development group at Rockwell International Electro-Optics Dept, Developing Infrared Image Sensors with readout electronics

Career Accomplishments

Associations / Societies
IEEE: Senior Member since April 17, 1999
Publications and Patents Summary
He has over 20 publications in journals/reports and 1 patent application filed

Additional Experience

Training / Seminars
1. CMOS Image Sensors:T. Expert presented CMOS Image Sensors Fundamentals
2. Advanced CMOS & BiCMOS VLSI Design:Practical Aspects in Analog & Mixed -Mode IC Design
3. ANALOG ARTIST: CadenceSchematic Editor and Simulation
4. VIRTUOSO:Cadence Layout Editor
5. UNIX:Basic
Other Relevant Experience
Lecturer: Course CMOS Analog Design at ORT Braude College, Carmiel Israel

Fields of Expertise

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