Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

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Expert Details

Hybrid Thick Film Circuit Layout, and Low Temperature Co-fired Ceramics: Design and Manufacturing

ID: 723792 Maryland, USA

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Expert has worked in the forefront of developing technology in the area of electronic ceramics for over thirty years, ranging from the early high-alumina ceramic substrate refinement for additive and subtractive microelectronic packaging circuit pattern definition to the advanced glass-ceramic substrate materials known as Low-Temperature Cofired Ceramics. He has applied these materials to RF and Microstrip configurations for low-power microelectronics in ceramic multi-conductor layer circuit boards. His innovations have included creation of cavities for containment of chip components, techniques for interconnecting chip components to the conductors within the multilayer structure, low loss, low dielectric constant ceramics for low-power level Microwave ceramic package structures, high-dielectric constant materials for buried passive components (capacitors), and high resistivity conductors for resistors buried within the glass-ceramic three-dimensional structure (body).

Education

Year Degree Subject Institution
Year: 1959 Degree: BS Subject: Physics Institution: University of Detroit
Year: 1961 Degree: MS Subject: Physics Institution: University of Detroit

Work History

Years Employer Title Department
Years: 2002 to 2005 Employer: Entegee Title: Senior Contractor Engineer Department: ESG-Engineering Services Group
Responsibilities:
Expert was assigned to an ESG client, Northrop Grumman Electronic Systems in Baltimore MD. Reporting to the VP of Engineering, he served as Liaison for placement of Key Engineering Talent (PhD, Senior Advisory Engineers) for the Electronic Systems Sector; He also provided Systems Engineering Support for standardization of Systems Engineering processes across all Northrop Grumman Corporation Sectors.
Years Employer Title Department
Years: 2000 to 2001 Employer: Adecco Title: Senior Contractor Engineer Department: Engineering
Responsibilities:
Assigned to Northrop Grumman, Baltimore. Assisted in recruitement and placement of electro-optics engineers. Maintained equipment in three EO labs, including their calibraton.
Years Employer Title Department
Years: 1997 to 1998 Employer: Adecco Title: Senior Contractor Engineer Department: Engineering
Responsibilities:
Assigned to Northrop Grumman, Baltimore. Responsible for Cost Proposals for many EO Systems. Assisted in recruitment and placement of electro-optics engineering candidates.
Years Employer Title Department
Years: 1996 to 2003 Employer: Technology Seminars, Inc. Title: Associate Lecturer Department: Education
Responsibilities:
Conducted In-Plant seminars on Hybrid Electronic Packaging, Advanced Materials Technology, High-Speed and Microwave Packaging. Clients included Automotive Industry, NSA, NASA, various Lucent Locations. Contributed chapters to five McGraw-Hill Electronic Engineering Handbooks.

Co-authored a book on Electronic Packaging of High Speed Circuitry.
Years Employer Title Department
Years: 1965 to 1995 Employer: Westinghouse Electronic Systems (Now Northrop Grumman Electronic Systems) Title: Senor Engineer, Fellow Engineer, Advisory Engineer Department: Engineering
Responsibilities:
Electronic Packaging of Hybrid Circuits. Included Thick Film circuitry on Ceramics, Thin Film Circuitry, Low Temperature Co-Fired Ceramics, Engineering Materials development for hybrid circuit conductors and insulating materials, wire bonding, chip bonding, microwave (microstrip) package and miniature coaxial connector development.
Years Employer Title Department
Years: 1961 to 1965 Employer: Sperry Gyroscope Company Title: Engineer Department: Air Armament
Responsibilities:
Electronic packaging and welded module development for solid state devices, including transistors and other miniature discrete components (resistors, capacitors, varactors) for airborne and submarine computers.
Years Employer Title Department
Years: 1959 to 1961 Employer: University of Detroit Title: Teaching Fellow Department: Graduate Program in Physics
Responsibilities:
Setting up experiments in General Physics for undergraduate students, teaching the lab courses, grading lab reports and quizzes.

Career Accomplishments

Associations / Societies
Vice-President for Technology, Board member and Technical Program Chair, International Electronics Packaging Society Symposium; Technical Session Chair, National Electronic Packaging Conference (NEPCON) three years; Tech Session Chair, Society for the Advancement of Material and Process Engineering (SAMPE) (1992).
Publications and Patents Summary
Four U.S. Patents and an additional 16 Invention Disclosures, two of which were determined by Westinghouse to be best kept as trade secrets, Contributed five chapters to McGraw-Hill Engineering Handbooks in Electronic Packaging Technology,

Co-authored a McGraw-Hill Engineering book regarding electronic packaging and circuitry.

Twenty technical papers on numerous aspects of hybrid electronic packaging, which reflect a variety of subtopics.

Additional Experience

Training / Seminars
Gave many in-plant seminars on the following topics: Electronic packaging technologies for High-Speed Digital and miniaturized microwave circuits, Advanced materials usage for high performance circuit packaging (High-Speed circuitry on printed wiring boards)
Vendor Selection
Worked to develop suppliers of thin film circuit resistor ladder networks, spending four months with three suppliers in the Boston area, assisting them in refining their thin film materials deposition and photoengraving pattern definition processes thereby making notable improvements in quality and yields.

Fields of Expertise

ceramic material selection, electronic packaging industry, semiconductor flat pack, electronic packaging technology, chip carrier, semiconductor device package, alumina substrate, ceramic tape, microwave circuit packaging, electronic packaging, ceramic package

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