Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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Expert Details

Materials for Electronic Applications

ID: 723180 California, USA

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Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in process. He has also submitted a new phase 1 program which is in the EPA review process. He has attended an EPA conference in Washington for phase 1 awardees, aimed at helping to understand the methods used to be successful in this area.

Expert has been active in the laminate field for many years. He was the chief technologist for Fortin laminating Corporation, was president of QLP Laminates for the Amp-Akzo joint venture, and has worked for Nelco in the area of flexible and rigid substrates. He has a strong background in technical, marketing, and management areas. He is current on new classes of laminate including lead free circuitry and high frequency requirements. He has consulted for the IPC, done work for UL, and participated in due diligence activities in this area. He has experience as an expert witness

Expert is active in many parts of interconnection technology. He is involved in sustrates for fine line and high frequency circuits with an emphasis on thin or flexible circuitry and materials. This includes adhesive-less substrates, sputtered and plated materials, sequential layer addition, additive and semi-additive techniques, via formation and filling, and many other aspects of this area.

Expert is involved in electo-deposition of magnetic materials, copper, and other metals and alloys. He has published many papers in this area. His work on insolible anodes for copper and precious metal plating is ongoing. Plating at very high current density for electrowinning and etchant regeneration is underway. The expert understands the effects of addition agents and plating bath chemistry along with parameters such as flow rate and patterns, temperature effects, current density effects, polarization, and other variables. He also has experience in electrochemical phenomena such as corrosion, anodization, anode shaping for throwing power, and other areas.

Expert has a strong background in the management of technical companies and activities. He has run R&D groups for major corporations. He has managed large departments and divisions with bottom line responsibility. In some positions, he has been responsible for marketing, production, engineering, and finances. Expert successfully started a company in flexible circuitry manufacturing, brought it to a profitable level, and sold the company to a Fortune 200 company. He has experience from start-up to running a division for a major corporation. He has been involved in a successfull turn-around, taking a company from a loss possition to being sold to a major corporation as required by plan. He has made presentations to boards of directors and CEOs. He has experience as an expert witness. He is capable of helping with planning, long term stategy, and immediate problems.

ExpertSallo has experience in all aspects of printed circuitry. He has managed activities which sell and manufacture circuit boards. He has a technical hands-on background in process engineering, process control, trouble shooting,and quality systems. He works in fine line circuitry, etching, plating, additive circuitry, lamination, coating, UL, IPC specs, ISO, military spec qualification, and other activities in manufacturing, engineering, marketing, and management. He has consulted for the IPC and UL. He has strength in new materials, material problems, laminate, and fact finding in quality issues.

ExpertSallo has worked with many of the major areas in this field. These include lead free circuit boards, thermally improved materials for lead free solder, halogen free materials, non-halogen flame retardants, disposable components and boards, thermoplstic materials such as LCP. In addition he is active in regeneration of etchants and recovery of the copper.

Expert has a strong background in development of new process and new materials for electronic components. Material work has included sputtering and electrodeposition on polymer films such as polyimide and liquid crystal (LCP). Work has been done on improved laminate materials including resins, reinforcements, and copper. Development of processes includes insoluble anodes for electro-deposition, improved plating techniques, bond enhancement, very thin substrate materials, and modified resin systems. Development of a novel electrolytic method for regenerating spent etchant and recovering etched copper as the metal is being done with EPA SBIR funding.

Much work has been done in electro-winning for zero discharge waste treatment. Expert has developed very high current density methods for recovering metals from waste treatment and automatically removing them from the system. New requirements will make this a necessity in the near future.


Expert has a strong background in this area. He has worked extensively with thin copper, both laminate and sputtered, to obtain 25µ lines and spaces. Additive and semi-additive methods have been employed. High quality etching with low undercut is another technique which can be used.
Yields are of primary consideration as are throughput and cost. This technology also makes use of thin substrate materials such as 12µ and 20µ polyimide and other base materials.

Array

He was an expert witness in a case involving heated roofing shingles. He researched the situation and gave 2 depositions. Case was resolved satisfactorally for his client. He worked with a client to market a water soluble silk screening ink. Found several customers and assisted in the technical evaluation of the productHe was involved as a partner in a program to build a facility to manufacture flexible printed circuitry in China. He made presentations to the Chinese authorities and helped to develop the total production and marketing planHe was chosen by the Defense Enterprise Fund to perform due diligence on a printed circuitry board manufacturing facility in Khazakstan. This was part of the effort to use Nunn Luger funding to prevent the migration of former Soviet nuclear scientists.He was chosen by Teradyne to perform due diligence relative to their acquisition of a printed circuit boart laminating facility.

Education

Year Degree Subject Institution
Year: 1955 Degree: PhD Subject: Chemistry Institution: University of Chicago
Year: 1951 Degree: BS Subject: Chemistry Institution: University of Illinois

Work History

Years Employer Title Department
Years: 1993 to Present Employer: Undisclosed Title: President Department:
Responsibilities:
He does consulting in technical, management, and marketing area. Over 50 clients since company inception
Years Employer Title Department
Years: 1993 to 1988 Employer: Amp Akzo JV Title: President Department: QLP Laminates
Responsibilities:
He was responsible for all aspects of this 200 person manfacturing company. It began as a "turnaround" and became a profitable division. Products were sold to printed circuit board manufacturers.
Years Employer Title Department
Years: 1988 to 1993 Employer: Gould Title: President Department: Microbond Technologies
Responsibilities:
He was responsible for all aspects of this company which manufactured and sold flexible printed circuitry
Years Employer Title Department
Years: 1983 to 1988 Employer: Microbond Technologies Title: president Department:
Responsibilities:
He started this company beginning with an R&D limited partnership, and using private placement for funding. Manufactured printed circuit boards and flexible circuits. The company was sold to Gould, a Fortune 200 company at the time.
Years Employer Title Department
Years: 1974 to 1983 Employer: Fortin Laminating Company Title: V P Technology Department:
Responsibilities:
He was responsible for all technical aspects of this company. products were glass epoxy laminates, flexible laminates and other products sold into the printed circuitry industry.
Years Employer Title Department
Years: 1967 to 1974 Employer: Lockheed Electronics Title: Manager Department:
Responsibilities:
Initiated department in electroplated magnetic memories. Departmernt was sold to Motorola.
Years Employer Title Department
Years: 1959 to 1967 Employer: Honeywell Title: Manager Department:
Responsibilities:
Managed a department in the Honeywell corporate research center
Years Employer Title Department
Years: 1955 to 1959 Employer: NCR Title: Research Scientist Department:
Responsibilities:
Available upon request.

Government Experience

Years Agency Role Description
Years: 2005 to 2005 Agency: EPA Role: Principal Investigator Description: He obtained a Phase 1 EPA SBIR program for Republic Anode Fabricators. The program deals with an electrolytic technique for the recovery and regeneration of spent etching solutions. The successful program has led to a phase 2 award which is currently in progress.

International Experience

Years Country / Region Summary
Years: 1996 to 1997 Country / Region: China Summary: He was a partner in plan to install a facility in Wuhan China to produce flexible circuitry laminate. He participated in the planning phases for production and marketing, and look part in the presentations in Wuhan
Years: 1995 to 1995 Country / Region: Khazakstan Summary: He was chosen by the Defense Enterprise Fund to visit a printed circuitry manufacturing facility on the nuclear testing site of the former Soviet Union, in Khazakstan. The purpose was to perform due diligance relative to an investment in the facility.

Career Accomplishments

Associations / Societies
He belongs to the Institute for Printed Circuitry (IPC).
Publications and Patents Summary
He holds over 20 patents and one active application. He has chapters in 2 technical books. He has presented many technical papers, including several to international organizations. He has been invited to present many papers.

Additional Experience

Expert Witness Experience
He was an expert witness in a case involving heating elements intended for roofing applications. He gave 2 depositions in the case
Training / Seminars
He has presented learning and training seminars at IPC meetings. He has extensive experience in presentations and technical training
Vendor Selection
He has been involved extensively in vendor qualification and selection
Marketing Experience
He has experience in marketing and sales, including a start-up and new product introduction
Other Relevant Experience
He has experience in funding start-ups, due diligence for financing, and technical evaluation of new products

Fields of Expertise

SBIR grant writing, printed circuit board laminate, backplane, printed circuit board substrate, interconnection technology, electronic material, electronic packaging, electrochemistry, electrochemical system, electrolysis, electrolytic solution, business management, market research, printed circuit industry, etched printed circuit board, circuit trace, multilayer printed circuit board, printed board assembly, printed circuit, printed circuit board, printed circuit board manufacturing, printed-wiring board, rigid-flex circuit board, surface-mount printed circuit board, board level technology, environmentally-friendly process changes in printed circuit manufacturing, research and development, electrochemical waste treatment, fine-pitch technology, computer to plate, competitive intelligence countermeasures, business development, small business, entrepreneurship, business strategy, business operations, plated through-hole via, competitive benchmarking, printed circuit board coating material, blind via, flex testing, photoetching, competitive intelligence, bare board, printed circuit board automated optical inspection, printed circuit board manufacture waste treatment, anisotropic etching, printed wiring assembly, physical organic chemistry, chemical bath control, through-hole technology, electronic material processing, electrochemical process material, printed circuit board product specification, printed circuit board manufacturing equipment, printed circuit board manufacturing facility, via, electronics metallurgy, corporate strategic planning, printed-wiring board fabrication, competitive analysis, printed circuit board design, silk-screen printing, chemical reaction, strategic planning, marketing, decision-making, strategic research planning, electromotive force, electrolytic analysis, electric cell

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