Expert in Semiconductor Assembly and General Technology Management
He has been responsible for all plastic package reliability at Intel and has been the assembly manager at four companies, Intel, Xicor, EDI and ASI before going onto senior management positions in those companies.
He is responsible for introducing novel integration processes that have and continue to generate revenues in excess of $4M.
Expert has a great deal of experience in Asia where his assembly and test facilities were located. He has negotiated several advantageous business initiatives that have saved millions of dollars and improved quality and shortened lead times significantly.
He has been involved with almost every aspect of packaging technology from Al corrosion to lead finish issues. It also included an extensive background in package thermal issues and exotic materials, i.e. diamond substrates. He currently writes the Assembly/Test section for IC Knowledge and has worked with a Big Consulting Company on Package Technology.
In addition, Expert has spent the last 20 years working with Military supplying Hi Rel devices. He has spoken at several Marcus Evans events, concerning packaging technology to solve obsolescence issues and chaired the Military AeroSpace Summit in Florida last year.
Expert may consult nationally and internationally, and is also local to the following cities: New York, New York - Yonkers, New York - Newark, New Jersey - Jersey City, New Jersey - Paterson, New Jersey - Elizabeth, New Jersey - Bridgeport, Connecticut - New Haven, Connecticut - Hartford, Connecticut - Philadelphia, Pennsylvania
|Year: 1974||Degree: MS Chemistry||Subject: Electrochemistry||Institution: Clarkson University|
|Years: 2006 to 2009||Employer: Austin Semiconductor Inc.||Title: President||Department:||Responsibilities: He was responsible for modernizing the entire operation which was focused on military supply with grow into the high end industrial market.|
|Years: 2004 to 2006||Employer: Austin Semiconductor Inc.||Title: VP of Operations||Department:||Responsibilities: Directed all manufacturing activities, including production control, purchasing, in-house custom assembly and subcons in Asia. Managed staff of 10 Engineers and 30 DLs, reporting to the President. Improved productivity by 20% lowered costs by 15% and gained back customer confidence at three major accounts. Implemented new plastic modules for military market.|
|Years: 2002 to 2003||Employer: Peak International||Title: Eastern Regional Sales Manager||Department:||Responsibilities: Directed sales activities east of the Mississippi from Canada to Florida. Provided technical support across all geographies. Developed new sales accounts for innovative products and grew revenue by 10% in a down market.|
|Years: 2000 to 2002||Employer: OSEI||Title: Sales Manager||Department:||Responsibilities: Directed sales of component assembly and test services across the entire Eastern seaboard. Provided technical support to the East Coast office in all areas of assembly and test technology.|