Expert Details

Expert in Thin Films, Vacuum Technology, thin film resistors, semiconductor processing

Expert ID: 108474 New York, USA

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Expert has over 25 years experience in all areas of physical vapor deposition. He is experienced in vacuum and sputter deposition, as well as reactive and diode sputtering. He heads a company offering services and manufacturing in this area, consults with industry, and is principal investigator of research contracts. He has worked with coatings and thin films for microelectronics, semiconductors, electronics packaging, optics, and industrial coatings. This experience includes work with conductive, dielectric, ceramic and evaporated films, among others. Expert's knowledge in the area of thin films encompasses properties, circuits, deposition, conductors, coatings, analysis, applications and resistors.

Expert has worked in leading positions developing semiconductor process steps and etching techniques, including wet chemical etching. He consults in this area.

As Founder of Thin Film Concepts, Expert is experienced with thin film devices, circuits, and sensors. Expert and engineers at Thin Film Devices are developing metallization and pattering processes for aluminum nitride, alumina, Teflon, etc.

Expert designs and consults on custom vacuum equipment. He has designed large and small chambers for many sputtering and evaporation requirements including vacuum processing. He is knowledgeable regarding vacuum deposition, vacuum measurement, vacuum-compatible materials, and vacuum pumps.

Consulted for a medical device company on the application and processing of thin film and sputtered components.Consulted on the fabrication of thin film device manufacture, and the cost to scale up to high volume production. Consulted on the failure of hermetic seals for optical package windows deposited by thin film and sputtering. Consulted on processes and equipment needed to produce masters for DVD and CD manufacturing. Consulted on processing problems to produce thin film sensors and packages for jet engines.

Expert may consult nationally and internationally, and is also local to the following cities: New York, New York - Yonkers, New York - Newark, New Jersey - Jersey City, New Jersey - Paterson, New Jersey - Elizabeth, New Jersey - Bridgeport, Connecticut - New Haven, Connecticut - Hartford, Connecticut - Springfield, Massachusetts

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Year Degree Subject Institution
Year: 1971 Degree: Ph.D. Subject: Materials Science Institution: M.I.T.
Year: 1967 Degree: B.S. Subject: Engineering, Science Institution: New York University

Work History

Years Employer Title Department Responsibilities
Years: 2004 to Present Employer: Undisclosed Title: President Department: Responsibilities: Consulting on thin film processing, semiconductor processing, assembly, sputtering, evaporation, pvd. etc.
Years: 1991 to 2009 Employer: Thin Film Concepts, Inc. Title: President, Director of Engineering Department: Thin film manufacturing, processing, development, semiconductor processing Responsibilities: Responsible for custom circuit manufacture, thin film devices, sputtering, custom evaporation, r and d in thin film device area
Years: 1987 to 1991 Employer: Microelectronics Laboratory, Columbia University Title: Associate Director Department: Materials Science Center Responsibilities: Research areas with Fortune 100 companies and government contracts on thin film packaging, sensors and other areas
Years: 1983 to 1985 Employer: Perkin-Elmer Title: Product Manager, Manager of Applications Department: Plasma Systems Division Responsibilities: responsible for world wide technical marketing and process development of sputtering systems
Years: 1981 to 1983 Employer: Siemens Title: Manager Department: Wafer Process Devices Responsibilities: GaAs laser development
Years: 1976 to 1981 Employer: Honeywell Title: Principal Resident Scientist Department: Responsibilities: Responsible for thin film package development
Years: 1971 to 1976 Employer: Naval Research Laboratory Title: Research Metallurgist Department: Responsibilities: Development of superconducting resonators for Naval Communications, sputtering of Vanadium Gallium superconductors, development of VGa wire

Government Experience

Years Agency Role Description
Years: 1971 to 1979 Agency: Naval Research Laboratory Role: Section Head Description: Work included conducting research on low-temperature superconductors for communications, the fabrication and testing of vanadium gallium superconducting wire, performing failure analysis, metallography, and working on thin film superconductors.

International Experience

Years Country / Region Summary
Years: 1983 to 1986 Country / Region: Japan, Korea, Europe Summary: Was product manager for sputtering and plasma equipment, and head of international marketing.

Career Accomplishments

Associations / Societies
Expert is a member of IEEE, American Vacuum Society, International Society of Hybrid Microelectronics, and American Society for Metals.
Publications and Patents Summary
He is the author of over 25 publications and three patents in superconducting materials.

Additional Experience

Expert Witness Experience
Expert was involved in a case pertaining to procedures for CD mastering, licensing, and patent infringement. He worked with a large law firm concerning a fortune 500 patent suit. This work involved writing responses and exhibits, evaluating technical and legal issues, depositions and discovery. His evaluations where used in an eventual settlement.

Expert has also worked with lay firms to evaluate restrictive components which would meet the definitions involving in an antitrust suit.
Vendor Selection
He has worked for many companies to locate new and used equipment for thin film coating requirements.
Marketing Experience
Expert was involved in the international marketing of sputtering and plasma equipment for Perkin-Elmer.
Other Relevant Experience
Expert has extensive background in the area of contacts to thin film superconductors and UBCO and thallium-based thin films; the contacts have been as low as 1.5 x 10(-8) ohm-cm(2). He has received research grants and contracts in this area.

Fields of Expertise

physical vapor deposition, vacuum deposition, sputter deposition, thin-film integrated circuit, ceramic thin film, dielectric film, diode sputtering, electrically conductive film, reactive sputtering, thin film, thin-film analysis, thin-film application, thin-film coating process, thin-film conductor, thin-film deposition, thin-film electrical property, thin-film property, thin-film resistor, vapor deposition, atomic layer deposition, semiconductor processing equipment, wet chemical etching, chemical etching, hybrid microelectronics science, thin-film circuit, thin-film circuit element, thin-film sensor, thin-film technology, vacuum technology, vacuum equipment, vacuum measurement, vacuum pump, vacuum-compatible material, thin film science, wet etching, CD-ROM mastering, CD mastering, deposition analysis, semiconductor industry chemical, semiconductor wafer backside metallizing, hybrid microelectronic device, video disk mastering, nitride compound, electronic packaging, via, ion sputtering, semiconductor material processing, semiconductor wafer cleaning, semiconductor device packaging process, semiconductor device manufacturing, static vacuum maintenance, electron-beam deposition, very large-scale integration, vacuum leak detection, microelectronics thin-film application, integrated-circuit packaging process, interconnection wiring, ion etching, etching, deposition, module, very high-speed integration, transparent conductive thin film, ceramic packaging process, gallium arsenide semiconductor, electric contact, integrated circuit assembly, wire bonding, semiconductor wafer, microelectronics science, thin-film optical property, semiconductor lithography, cryopump, resistor, ultra-high vacuum, thin-film capacitor, semiconductor thermal oxidation, superconductivity, superconducting material, soldering material, semiconductor metallizing, semiconductor device, photoresist, ultraviolet lithography, optical thin film, optical coating material, multichip module, microlithography, magnetic thin film, leak detection, ion pump, interconnection technology, integrated optics, evaporated film, diffusion pump, DC sputtering, coating, ceramic superconductor, ceramic multichip module

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