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Expert ID: 735143 Arizona, USA

Expert in Semiconductor Packaging, SMT, Flip Chip and WLCSP Assembly, Failure Analysis, Advanced Packaging Substrates, Printed Circuit Boards, Product Development

Advanced Semiconductor Packaging, Expert Witness & Technology Due Diligence, Technology Investment Advising Dynamic Senior Engineering Manager with more than 15 years of International Semiconductor Packaging development and high-volume manufacturing of advanced IC packages for mobile, automotive and medical end applications.…

Expert ID: 734284 Canada

Expert in Electronic Packaging and LED\’s

Expert is a thought leader in microelectronic packaging and assembly issues. She has written or supervised thousands of failure analysis or reverse engineering reports on microelectronic components: IC's, active discretes (e.g., power transistors, diodes, LED's, and lasers), and passives (resistors,…

Expert ID: 733416 South Carolina, USA

Expert in Electronic Materials, Processes, and Components (esp. Capacitors)

Technologist with >25 years experience in R&D, product development, business identification and development, including design, materials, processing, testing and packaging. Strong track record of taking ideas to profitable products. 20 granted US Patents. Author/presenter with over 60 publications and presentations.…

Expert ID: 732736 California, USA

Expert in Electronic Engineering

Expert has over 40 years’ experience helping develop and launch products for Silicon Valley-high technology industries. He has designed or participated in the development of a 3MW switch used in the utility power conversion and distribution industry, a 20W dc/dc…

Expert ID: 732366 Vermont, USA

Expert in Semiconductor Technology and Microelectronics

Expert has microelectronics development, fabrication, manufacturing and intellectual property expertise acquired over a successful hands-on career spanning more than 3 decades, and covering CMOS semiconductor device technology nodes from 1um down to 14nm (current). His experience is both in-depth and…

Expert ID: 732251 Florida, USA

Expert in Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material

Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and package development…

Expert ID: 731984 New Hampshire, USA

Expert in Materials Technology, Powder Metallurgy, Advanced Ceramics, Process & Product Development, R&D, Lean

25+ years of experience in successfully managing and spearheading R&D and Operations projects to completion. Developed new products and processes, led cross-functional teams, project management and implementation, mentored subordinates and peers, provided team building and leadership, problem solving skills, and…

Expert ID: 730965 Israel

Expert in Semiconductor Fabrication, Packaging, Laser Processing, Reliability, GaN, Power Electronics and Devices

This expert has his doctorate from the world's top research university with over 25 years experience in semiconductor device fabrication and manufacturing. He has several patents related to laser processing of application specific circuitry and redundancy in DRAM and SRAM.…

Expert ID: 727749 California, USA

Expert in Electromagnetic Systems, Directed Energy, Radar, Electronic Warfare, New Technology Acquisition.

Expert has researched the PV cell technologies now in production and in the pipeline. While promising incremental efficiency and cost improvements abound, several "completely different" approaches were found that can produce 80%-90% conversion efficiencies across broad spectral bands at roll-to-roll…

Expert ID: 727044 New York, USA

Expert in Semiconductor Assembly and General Technology Management

Expert has worked in Assembly Technology since 1977 at such leading companies as Intel and Orient Semiconductor. During the last 30 years, he has amassed a great deal of hands on experience with the interaction of the wafer fabrication process…

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