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Electronic Packaging and LED\’s
Expert is a thought leader in microelectronic packaging and assembly issues. She has written or supervised thousands of failure analysis or reverse engineering reports on microelectronic components: IC's, active discretes (e.g., power transistors, diodes, LED's, and lasers), and passives (resistors,…
Thermal Management, Electronic Packaging, Mechanical Engineering
Worked on experimental and numerical simulation in two-phase heat and mass transfer, high-heat-flux cooling, spray, jet, flow boiling, aerospace thermal management, heat pipes, ice accretion, HVAC, turbomachinery, computational fluid dynamics: incompressible and viscous flows with heat transfer, signal processing, computer…
Semiconductor Fabrication, Packaging, Laser Processing, Reliability, GaN, Power Electronics and Devices
This expert has his doctorate from the world's top research university with over 25 years experience in semiconductor device fabrication and manufacturing. He has several patents related to laser processing of application specific circuitry and redundancy in DRAM and SRAM.…
Materials R&D/Product Development, Gold Alloys, Electronics Packaging & Assembly, Polymer Science
Expert's has been actively involved in strategic planning or management decisions that affect the performance or direction of a company. His experience is mainly in R&D and product development. His specific tasks have included understanding customers mid and long term…
Digital Printing, Inks, Flexible Packaging, Coatings Materials & Processes, UV Cure, Printed Electronics
Some clients call expert "our reserve technical director", referencing his ability to succeed with any activity a manufacturing technical director may be assigned. Such activities range from issues a vendor may have with its suppliers through to those of an…
Renewable Energy, Biofuels, Microelectronics, Semiconductor Packaging, Water Technologies, Agronomy
Expert has over 12 years of experience in Mergers & Acquisitions, representing both buyers and sellers. He has completed several deals and negotiated terms to maximize value. He has worked with clients to assimilate acquisitions regarding culture, economies of scale,…
Mechanical Engineering, New Product Design and Development, Fluid Systems, Electronics Packaging
Expert has been in business developing new products since 1985, specializing in instrumentation, medical and laboratory equipment. Besides electronics, some other areas of expertise include: mechanical components and systems, plastics, pneumatic and fluid systems, thermal design and analysis, packaging of…
Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…
Business Mentor and Patent Management Specializing Electronic Assembly (SMT, FPT, Heterogeneous) and Semiconductor Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) contract design and assembly foundry and…
InkJet, Inks, Packaging, Graphic Arts, Raw Materials, Printing Processes, Packaging for Food, Printing Problems, Problems with Packaging, Synthesis, Chemistry, Analytical Chemistry, Dispersion
Expert has been active in inks and coatings, advanced materials, and medicinal chemistry for over 25 years. His lab develops novel chemistries and invents products people touch every day. Expert also specializes in formulation, synthesis, separation, and identification of natural…