Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 732666 Ohio, USA

CMOS/CCD Image Sensor, Analog Design, High-speed IC, and RF

Expert's specialties include researching, modeling and designing the readout and high-speed ADC for SPEAR communication system under ONR funded BAA at OSU in a commercial Bi-CMOS process. Prior to joining the Ohio State University, Expert spent over 10 years in…

ID: 731865 India

Semiconductor Industry Technology, IC Process & Manufacturing, HW Systems Specialist with Patents

Expert is a Board of Director/Technical Advisor in several start-up Technology firms. As Chief Technical Advisor to a Venture/PE fund, he evaluated several Technology companies in the areas of Software, Semiconductor and System HW. He is also associated as the…

ID: 726141 New Jersey, USA

Circuit Design Engineer–Analog, Power Supply, EMI, Video, Audio, RF, Motors, Sensors, Ckt Simulation

He has extensive analog circuit design skills and he is expert in using mathematical derivation analysis of systems/circuits coupled with confirming computer modeling and simulation tools such as PSpice, Mathcad, MATLAB, and Excel. He is an expert in both the…

ID: 723854 California, USA

RF, Wireless, Microwave, Analog, Digital and Video System and Design Engineering

Expert is an RF/Microwave Engineering Consultant with 33 years of experience in the areas of RF, Microwave, Wireless, Analog, and high-speed Digital/FPGA designs. Expert recently completed a Patent Research project on an ITC Section 337 lawsuit that involved a number…

ID: 723560 California, USA

Semiconductor Industry IC Package Design and Development, Consulting and Training

Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert has Ph.D. in analyzing interconnection technologies, including…

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