Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 732464 United Kingdom

RF and Microwave Engineering for the Aerospace and Defence Sector

Expert has 15 years of experience in the design of microwave circuit components for the space, aerospace and defense sectors. These components include planar active circuits such as LNA's, other amplifiers, pin diode switches, attenuators, phase shifters, oscillators and planar…

ID: 732133 California, USA

RFIC, AMS and ROIC Circuit Design; IP and Patents; System Design; New Business, SBIR and Proposals

He has extensive experience in high-performance / high-dynamic range analog mixed signal, custom digital, and RF integrated circuit design, layout, and test, from concept to production for commercial, military, and space IC products. He has knowledge of IC process development,…

ID: 732110 Canada

Electronics R&D – New Product Development – Electronic Security Systems and Sensors

Expert has over 34 years’ experience in the field of electronic security systems and sensors, electronics R&D, and new product development. His expertise has spanned from hands-on work to senior executive leadership. This includes spending over 18 years as Head…

ID: 730712 California, USA

Integrated Circuits, Wireless Communication Circuits, RF-IC, Analog IC, Mixed-Signal IC

Professional expertise in the general area of analog, mixed-signal, microwave, radio-frequency circuits design using CMOS, bipolar, compound semiconductor technologies Consulted for a start-up company called Saber-Tek. Designed the millimeter-wave front-end for a high-speed short-range wireless transceiver.

ID: 730520 New York, USA

Motion Sensors, Occupancy Sensors, Passive Infrared, Analog, Digital, Electronics & Proposals

Degreed, self-starting Electrical Engineer (BEE) who specializes in digital and analog circuit and system design and hardware, firmware, and software development. Skilled in the design, invention, and innovation of high technology security electronics. Extensive background in digital circuitry enhanced with…

ID: 725847 Texas, USA

Low Power Chip Design, Verification, DSP, and Algorithms

He has worked with design and validation of popular bus arhcitectures and protocls such as AMBA and PCI. He has worked with design an development of Microprocessors and Texas Instruments Digital Signal Processors. He has worked as designer on x86…

ID: 725326 California, USA

Semiconductor Packaging and Assembly, Systems Engineering, and Materials Science.

Expert has designed a digital press having the lithographic performance of photo gravure, but able to stream continuous data for variable printing. The performance includes 2400 dpi resolution, 200 fpm web speed, and 48-inch wide print dimension. The press has…

ID: 725037 Minnesota, USA

Development and Assurance of High-Assurance / Safety-Critical Software & Embedded Systems

Expert has substantial experience with software safety and reliability. Most of his career has been spent working with high-assurance systems and safety-critical software. He has developed software for commercial aviation systems, for medical devices, and for industrial controls and safety…

ID: 723854 California, USA

RF, Wireless, Microwave, Analog, Digital and Video System and Design Engineering

Expert is an RF/Microwave Engineering Consultant with 33 years of experience in the areas of RF, Microwave, Wireless, Analog, and high-speed Digital/FPGA designs. Expert recently completed a Patent Research project on an ITC Section 337 lawsuit that involved a number…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

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