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Expert ID: 732133 California, USA

Expert in RFIC, AMS and ROIC Circuit Design; IP and Patents; System Design; New Business, SBIR and Proposals

He has extensive experience in high-performance / high-dynamic range analog mixed signal, custom digital, and RF integrated circuit design, layout, and test, from concept to production for commercial, military, and space IC products. He has knowledge of IC process development,…

Expert ID: 730392 Pennsylvania, USA

Expert in Materials, Processes and Hermeticity Testing of Microelectronics for Aerospace and Medical Implants

He has demonstrated expertise in hermetic sealing and leak testing processes for cavity style packaged microcircuits intended for high reliability military, aerospace and Class III medical implants. He has worked as a hermeticity consultant for prominent military and aerospace companies…

Expert ID: 729232 Ohio, USA

Expert in Thin-Film Deposition, Lasers, Optical Spectroscopy, Cryogenics

The last twenty years Expert has worked in France, Japan and US holding positions in the industry, academia and government. He has contributed to the fields of nonlinear optics (bistability), superconductivity, thin-film deposition (in particular pulsed-laser deposition), photoluminescence of low…

Expert ID: 727799 California, USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling

Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC substrate manufacturing. He interfaced with…

Expert ID: 724211 California, USA

Expert in Radiation Effects on Electronics, Single Event & Gamma Effects (SEE), and Test and Analysis Services

Expert has momentous years of experience in the assessment of space electronics systems to single event effects (SEE) and nuclear transient radiation effects. This includes single event upset, latchup and gate rupture. He also has an extensive history working in…

Expert ID: 108191 Maryland, USA

Expert in Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

Expert ID: 108084 Missouri, USA

Expert in Electronic Ceramics, Glasses, Fracture Lamps

He has been broadly active in the ceramic and glass issues of glass-to-metal sealing, thick film processing, and ceramic packaging. He has most recently focused on low dielectric constant packaging materials, A1N-compatible thick film systems, and glass feed-through technologies. He…

Expert ID: 108474 New York, USA

Expert in Thin Films, Vacuum Technology, thin film resistors, semiconductor processing

Expert has over 25 years experience in all areas of physical vapor deposition. He is experienced in vacuum and sputter deposition, as well as reactive and diode sputtering. He heads a company offering services and manufacturing in this area, consults…

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