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RFIC, AMS and ROIC Circuit Design; IP and Patents; System Design; New Business, SBIR and Proposals
He has extensive experience in high-performance / high-dynamic range analog mixed signal, custom digital, and RF integrated circuit design, layout, and test, from concept to production for commercial, military, and space IC products. He has knowledge of IC process development,…
Materials, Processes and Hermeticity Testing of Microelectronics for Aerospace and Medical Implants
He has demonstrated expertise in hermetic sealing and leak testing processes for cavity style packaged microcircuits intended for high reliability military, aerospace and Class III medical implants. He has worked as a hermeticity consultant for prominent military and aerospace companies…
Thin-Film Deposition, Lasers, Optical Spectroscopy, Cryogenics
The last twenty years Expert has worked in France, Japan and US holding positions in the industry, academia and government. He has contributed to the fields of nonlinear optics (bistability), superconductivity, thin-film deposition (in particular pulsed-laser deposition), photoluminescence of low…
IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC substrate manufacturing. He interfaced with…
Radiation Effects on Electronics, Single Event & Gamma Effects (SEE), and Test and Analysis Services
Expert has momentous years of experience in the assessment of space electronics systems to single event effects (SEE) and nuclear transient radiation effects. This includes single event upset, latchup and gate rupture. He also has an extensive history working in…
Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…
Thin Films, Vacuum Technology, thin film resistors, semiconductor processing
Expert has over 25 years experience in all areas of physical vapor deposition. He is experienced in vacuum and sputter deposition, as well as reactive and diode sputtering. He heads a company offering services and manufacturing in this area, consults…