Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 725326 California, USA

Semiconductor Packaging and Assembly, Systems Engineering, and Materials Science.

Expert has designed a digital press having the lithographic performance of photo gravure, but able to stream continuous data for variable printing. The performance includes 2400 dpi resolution, 200 fpm web speed, and 48-inch wide print dimension. The press has…

ID: 722421 California, USA

RFID, Operations Management, R&D Strategy, Project Management, Supply Chain & Logistics

Expert R. Expert was a pioneer in the "surface mount revolution" where he developed packaging, interconnect, process, and design technologies to enable high volume, small footprint manufacturing of two-way radios, cellphones, and pagers. He has led green field factory development…

ID: 108167 New Jersey, USA

Microoptic Devices, Specialty Products, Polymer Chemistry, Epoxy Encapsulants, etc.

TECHNOLOGY DEVELOPMENT; TECHNICAL MARKETING; TECHNOLOGY TREND; TIME-TO-MARKET. Expert has over 37 years of experience in product development, business development, and business consulting. As Manager of Advanced Manufacturing for Allied-Signal, Inc., Expert achieved critical time-to-market objectives by moving innovative state-of-the-art prototype…

ID: 712047 New Jersey, USA

Microcontroller-based Product Design

Most of the projects expert has been involved with have been real-time dependent. He has designed high-speed bit-slice-based data acquisition units for military aircraft radar, high-speed machinery controls, home automation, cordless telephones, fitness equipment, arcade games, and other consumer products.…

ID: 108506 Tennessee, USA

Surface Mount Technology

Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. He is familiar with materials, component packages, and the related…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

ID: 717493 Minnesota, USA

Vacuum Processes, Optical Multilayer Thin Films, Ophthalmic Lenses, Photochromic Dyes, Diamond film

THIN FILM, HIGH VACUUM, THIN-FILM DEPOSITION PROCESS. Expert has expertise in many aspects of thin film deposition processes including physical vapor deposition, rf and dc magnetron sputtering, ion beam sputtering, ion-assisted deposition, and chemical vapor deposition (CVD). He developed an…

ID: 107605 Virginia, USA

Satellite Telecommunications

President and CEO Ms. Expert and her staff at Employer offer an aggregate of over 200 years of experience in the satellite communications revolution. Employer's company headquarters are in Fairfax, VA with remote offices in Atlanta, New Orleans, Colorado Springs,…

ID: 720603 New Mexico, USA

Semiconductor Processing and Equipment

Expert has more than 23 years experience in the semiconductor industry, much of this time in a technical management position at Intel. He has hands-on experience with nearly every facet of processing silicon wafers to manufacturing semiconductor devices. His strength…

ID: 720281 California, USA

Semiconductor Devices, Testing and Product Engineering, Marketing and Administration

Expert has spent most of his career in the semiconductor device and process technology areas. His experience is wide, with exposure to germanium and silicon discrete to large scale silicon integrated devices in the sub-micron regime. An area that is…

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