Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

×

Find an Expert

ID: 732251 India

Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material

Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and package development…

ID: 730392 Pennsylvania, USA

Materials, Processes and Hermeticity Testing of Microelectronics for Aerospace and Medical Implants

He has demonstrated expertise in hermetic sealing and leak testing processes for cavity style packaged microcircuits intended for high reliability military, aerospace and Class III medical implants. He has worked as a hermeticity consultant for prominent military and aerospace companies…

ID: 723560 California, USA

Semiconductor Industry IC Package Design and Development, Consulting and Training

Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert has Ph.D. in analyzing interconnection technologies, including…

ID: 108506 Tennessee, USA

Surface Mount Technology

Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. He is familiar with materials, component packages, and the related…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

ID: 717493 Minnesota, USA

Vacuum Processes, Optical Multilayer Thin Films, Ophthalmic Lenses, Photochromic Dyes, Diamond film

THIN FILM, HIGH VACUUM, THIN-FILM DEPOSITION PROCESS. Expert has expertise in many aspects of thin film deposition processes including physical vapor deposition, rf and dc magnetron sputtering, ion beam sputtering, ion-assisted deposition, and chemical vapor deposition (CVD). He developed an…

ID: 716910 California, USA

Business Mentor and Patent Management Specializing Electronic Assembly (SMT, FPT, Heterogeneous) and Semiconductor Packaging

Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) contract design and assembly foundry and…

Dev Tool:

Request: experts/multichip-module-packaging-process
Matched Rewrite Rule: ^experts\/([^\/]*)\/?([^\/]*)\/?
Matched Rewrite Query: pagename=experts&searchKeyword=multichip-module-packaging-process&searchDiscipline=
Loaded Template: page-experts.php