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Semiconductor Packaging, SMT, Flip Chip and WLCSP Assembly, Failure Analysis, Advanced Packaging Substrates, Printed Circuit Boards, Product Development
Advanced Semiconductor Packaging, Expert Witness & Technology Due Diligence, Technology Investment Advising Dynamic Senior Engineering Manager with more than 15 years of International Semiconductor Packaging development and high-volume manufacturing of advanced IC packages for mobile, automotive and medical end applications.…
Materials, Formulations, Coatings & Process Research & Development
Expert has 36 years experience in coating, material, formulation, and process research & development. He has commercialized formulations for the first large capacity optical recording media, the Kodak 68100 LWR media. His novel and patented organic molecular glasses have seen…
Thermosetting Polymers, Product Development Process, New Business Development
Expert is a nationally recognized authority in thermosetting polymers. He has developed a fundamental understanding of thermosetting polymers including detailed experience in the rheology of curing systems (chemorheology), cure kinetics, physical property measurements, dielectric measurements of curing, and process development.…
IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC substrate manufacturing. He interfaced with…
Digital Printing, Inks, Flexible Packaging, Coatings Materials & Processes, UV Cure, Printed Electronics
Some clients call expert "our reserve technical director", referencing his ability to succeed with any activity a manufacturing technical director may be assigned. Such activities range from issues a vendor may have with its suppliers through to those of an…
Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert has Ph.D. in analyzing interconnection technologies, including…
Industrial Hygiene, Occupational Health, Hazardous Materials Management, Emergency Response
He championed the implementation of a variety of strategies to reduce workplace accidents and injuries. Strategies included establishment of on site workplace health and safety teams. These teams included both management and labor employees who worked together to identify safety…
Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase…
Complete vertical product integration: EMC/EMI, Wireless, IoT, Audio/Video, Automotive, Imaging, Hardware, Firmware, Cloud
Expert has expertise in the design of biomedical imaging products, providing patient safety and comfort regarding ISO and FDA requirements. He is an Adjunct Professor teaching on biomedical instrumentation including cardiac, ultrasonic equipment, pressure and flow measurements. He has magnetic…
Mechanical Engineering Design and Analysis
Expert has more than 30 years of experience in providing mechanical engineering support to electronic and LASER products for military and commercial applications. He has performed in engineering, program, and supervisory roles including design, analysis, budgets, scheduling, manufacturing support, field…