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Expert ID: 725449 Arizona, USA

Expert in Semiconductor Wafer and Packaging Materials, Process, Equipment & Quality

Semiconductor Manufacturing Processes and Control Electronic Assembly and packaging Project / Program Management Metallurgical Engineering & Materials Senior Western USA Consulting Manager for Digital Equipment Engineering and Manufacturing - likely 20+ major clients like Intel, Motorola, US Navy, Signetics, Medtronics,…

Expert ID: 733681 Ohio, USA

Expert in Sputtering targets, semiconductor supply chain, tantalum, copper, aluminum and titanium metals for semiconductors. ERP systems implementation.

Experience includes 26 years working in the semiconductor supply chain providing high purity PVD sputtering targets. Worked with leading edge semiconductor customers and quality systems. Supply chain expertise includes high purity aluminum, titanium, copper and tantalum semiconductor grade materials. •…

Expert ID: 735143 Arizona, USA

Expert in Semiconductor Packaging, SMT, Flip Chip and WLCSP Assembly, Failure Analysis, Advanced Packaging Substrates, Printed Circuit Boards, Product Development

Advanced Semiconductor Packaging, Expert Witness & Technology Due Diligence, Technology Investment Advising Dynamic Senior Engineering Manager with more than 15 years of International Semiconductor Packaging development and high-volume manufacturing of advanced IC packages for mobile, automotive and medical end applications.…

Expert ID: 731467 Taiwan

Expert in Semiconductor Market in Greater China, IC Testing Solutions and Market

Expert has been working in the semiconductor field more than 20 years, 18+ years working for IC testing related businesses as a sales professional. He has been involved in wafer testing (related Probe card, prober), through package testing and then…

Expert ID: 730965 Israel

Expert in Semiconductor Fabrication, Packaging, Laser Processing, Reliability, GaN, Power Electronics and Devices

This expert has his doctorate from the world's top research university with over 25 years experience in semiconductor device fabrication and manufacturing. He has several patents related to laser processing of application specific circuitry and redundancy in DRAM and SRAM.…

Expert ID: 729977 Virginia, USA

Expert in Semiconductor Technology

Presently, Expert is full Professor in the Department of Electrical and Computer Engineering at a U.S. University. He received a Master’s degree in experimental physics in 1976, and a Ph.D. in theoretical physics in 1979, both from Tuebingen University, Germany.…

Expert ID: 727767 New Jersey, USA

Expert in Wireless Communications, LTE, WiMax, WiFi, Satellite, Semiconductor Technology

Expert is an IP Technologist and has experience working with executives and investment professionals seeking expert advice with critical intellectual property matters. Prior to performing IP services, Expert spent eight years building a technology consulting practice as both a Founder…

Expert ID: 727044 New York, USA

Expert in Semiconductor Assembly and General Technology Management

Expert has worked in Assembly Technology since 1977 at such leading companies as Intel and Orient Semiconductor. During the last 30 years, he has amassed a great deal of hands on experience with the interaction of the wafer fabrication process…

Expert ID: 726110 California, USA

Expert in Semiconductor Transistor & BEOL Technology (Logic,Memory,CIS,Power device) & Photovoltaic Technology

Expert is an expert in the Chemical Vapor Deposition (CVD) and Chemical Vapor Deposition Reactor design areas. His PhD work was on Metal Organic Chemical Vapor Deposition of GaAs, which involved the design and construction of an Atmospheric Pressure Chemical…

Expert ID: 725326 California, USA

Expert in Semiconductor Packaging and Assembly, Systems Engineering, and Materials Science.

Expert has designed a digital press having the lithographic performance of photo gravure, but able to stream continuous data for variable printing. The performance includes 2400 dpi resolution, 200 fpm web speed, and 48-inch wide print dimension. The press has…

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