Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 732666 Ohio, USA

CMOS/CCD Image Sensor, Analog Design, High-speed IC, and RF

Expert's specialties include researching, modeling and designing the readout and high-speed ADC for SPEAR communication system under ONR funded BAA at OSU in a commercial Bi-CMOS process. Prior to joining the Ohio State University, Expert spent over 10 years in…

ID: 732133 California, USA

RFIC, AMS and ROIC Circuit Design; IP and Patents; System Design; New Business, SBIR and Proposals

He has extensive experience in high-performance / high-dynamic range analog mixed signal, custom digital, and RF integrated circuit design, layout, and test, from concept to production for commercial, military, and space IC products. He has knowledge of IC process development,…

ID: 730520 New York, USA

Motion Sensors, Occupancy Sensors, Passive Infrared, Analog, Digital, Electronics & Proposals

Degreed, self-starting Electrical Engineer (BEE) who specializes in digital and analog circuit and system design and hardware, firmware, and software development. Skilled in the design, invention, and innovation of high technology security electronics. Extensive background in digital circuitry enhanced with…

ID: 729511 California, USA

M2M Sensor Processing with Zigbee, GSM & CDMA. Analog & FPGA design. PCB Layout with Expedition

Expert has 22 years of experience in analog & digital signal processing, specializing in sensors. He is experienced in closed loop control systems for motor drives (2, 3 and 4 phases) and cryocoolers. His company has developed mobile to mobile…

ID: 728559 New York, USA

Phased Array Radar Systems, Antenna, Microwave, Guidance and Control Systems

Expert has more than 20 years with defense industry (Lockheed Martin, and Raytheon). He is a Radar System Expert and Analyst of Radar System performance and Phased Array Radar Systems for more than 15 years (recently designed EQ-36 mortar radar,…

ID: 727787 California, USA

General Circuit Design and Integration on Silicon

Expert has 31 years of engineering experience in silicon integrated circuit design and development. His expertise ranges from device and process development to analog, digital, mixed signal circuit design which makes him an authority on overseeing probable difficulties that may…

ID: 727025 Massachusetts, USA

Design of Analog Hardware, Power Converters, RF/Microwave, Medical Equipment & PCB Design

Expert has been an analog and system designer for the better part of 25 years. Expert has worked in RF and microwave designs (both commercial and government) requiring filtering, amplification and interconnection techniques from 200 MHz to 30 GHz. He…

ID: 724336 California, USA

Radio Frequency / Analog / Mixed-Signal Integrated Circuit Design. Wireless Communications.

Expert has designed Radio Frequency/ Analog/Mixed-Signal integrated circuits for over 21 years. He has successfully lead projects and designed products from concepts to mass production in the wireless and hard disk drives industries. He has design integrated circuits in CMOS/BiCMOS/Bipolar…

ID: 723854 California, USA

RF, Wireless, Microwave, Analog, Digital and Video System and Design Engineering

Expert is an RF/Microwave Engineering Consultant with 33 years of experience in the areas of RF, Microwave, Wireless, Analog, and high-speed Digital/FPGA designs. Expert recently completed a Patent Research project on an ITC Section 337 lawsuit that involved a number…

ID: 723560 California, USA

Semiconductor Industry IC Package Design and Development, Consulting and Training

Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert has Ph.D. in analyzing interconnection technologies, including…

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