Expert Details
Design for Test, Test Strategy, SMT Mfg, High-Speed Dig Design & PCB Layout, EMI/EMC, Digital Design
ID: 714785
Washington, USA
Expert has conducted tutorials and workshops at many trade shows, conventions, symposiums, and conferences in the United States and internationally. He has taught various electrical engineering classes at the University of Washington, Washington State University, and Seattle Community College. He has conducted special continuing engineering education classes for the University of Wisconsin, University of California - Berkeley, University of California - Los Angeles, George Washington University, Oregon Graduate Institute of Technology, Oxford University (England), and Seattle Pacific University.
Expert has performed on-site consulting with approximately seventy companies in the United States and internationally. He has taught personnel with virtually all Fortune 500 companies in the U.S.
Among honors Expert has received in industry was Boeing Aerospace Man of the Year Award which he won for consolidating testing techniques for the B1-B program that saved approximately $6,000,000.
He is proficient in several SMT implementation strategies including capital equipment considerations, assembly subcontractor partnerships, component selection and procurement, quality function deployment options, and cost-effective test strategies.
Familiar with in-circuit test fault detection and fault isolation techniques, Expert applies his knowledge to correct manufacturing process problems. He has tested bareboards with blind and buried vias and controlled impedance requirements. He teaches a course entitled "Testing Surface Mount Technology: Practical Bareboard and In-Circuit Strategies" throughout the U.S., Asia, and England.
Expert has expertise in electronics testing. He has extensive experience with through-hole, SMT, commercial, and military electronics. As a test strategist for Boeing, he is very knowledgeable in areas of component, in-circuit, board/system functional, continuity, and robotic testing. He has pioneered areas of built-in self-test, design for testability, and design for productibility. He has also concentrated on SMT test issues.
Expert teaches SCAN techniques at companies and conferences nationwide and is very familiar with IEEE 1149.1 standard. He has designed IEEE 1149.1 boundary scan circuits into ASIC circuitry.
Expert has provided in-plant test-production service to 23 companies, including Ford Motor Company, GE, Solectron, Boeing,
Intel. He conducted High-Speed Digital Design and ABCs of Electronic Technology training at the Intel Folsom, CA Facility.IBM. He conducted High-Speed Digital Design and Advanced High-Speed Digital Design training at the Raleigh, NC facility. AMD. He conducted High-Speed Digital Design, High-Speed Digital Design for Non-EEs, and Advanced High-Speed Digital Design at the Austin TX facility as well as at their facility in Dresden, Germany.Texas Instruments. He conducts high-speed digital design, SMT Manufacturing, SMT Test, EMI/EMC, and Digital Design at the Dallas, TX facility.Freescale Technology. He conducts high-speed digital design at the Novi, MI,, and Austin, TX facilities.
Education
Year | Degree | Subject | Institution |
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Year: 1966 | Degree: MSEE | Subject: | Institution: Computers & Logic - University of Southern California |
Year: 1963 | Degree: BSEE | Subject: | Institution: Electrical Engineering - University of Washington |
Year: 1959 | Degree: BSBA | Subject: | Institution: Business Administration - University of North Dakota |
Year: 1959 | Degree: BSIE | Subject: | Institution: Industrial Engineering - University of North Dakota |
Work History
Years | Employer | Title | Department |
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Years: 1991 to Present | Employer: Undisclosed | Title: Electronics/Test Instructor/Consultant | Department: |
Responsibilities:Train and consult in areas of expertise as listed in this bio. |
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Years | Employer | Title | Department |
Years: 1988 to 1991 | Employer: Principal Engineer, Boeing Aerospace (Commercial AvionicsDivision ) | Title: | Department: |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1987 to 1988 | Employer: Principal Engineer, Boeing Electronics Company | Title: | Department: |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1985 to 1987 | Employer: Assistant Manager, Manufacturing Test Engineering, Goodyear Aerospace | Title: | Department: |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1982 to 1985 | Employer: Project Engineer, Boeing Military Airplane Company | Title: | Department: |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1977 to 1982 | Employer: Project Engineer, Honeywell | Title: | Department: |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1959 to 1977 | Employer: Design & Software Engineer, Boeing Aerospace Co. & Rockwell | Title: | Department: |
Responsibilities:Available upon request. |
Government Experience
Years | Agency | Role | Description |
---|---|---|---|
Years: 2004 to Present | Agency: NASA Huntsville | Role: Instructor | Description: Training High-Speed Digital Design and EMI/EMC. |
Years: 2006 to 2006 | Agency: NASA Dryden | Role: Instructor | Description: Training High-Speed Digital Design and EMI/EMC. |
Years: 2003 to Present | Agency: U.S. International Trade Commission | Role: Instructor | Description: Training ABCs of Electronic Technology and Digital Design |
Years: 1987 to Present | Agency: Subcontractors for US Govt | Role: Instructor/Consultant | Description: He trains/consults for government sub-contractors including Boeing, Raytheon, Northup Grumman, DDI, Honeywell, 3M, Loral Aerospace, Martin-Marietta, Lockheed, Rockwell, SRI, TRW. |
International Experience
Years | Country / Region | Summary |
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Years: 1996 to Present | Country / Region: Mexico | Summary: He provides training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for the Mexitronica Conference in Guadalajara. |
Years: 2001 to 2005 | Country / Region: Union of South Africa | Summary: He provided training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for the South African engineering community. |
Years: 1997 to 2001 | Country / Region: United Kingdom and Germany | Summary: He provides training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for Oxford University, Xyratex, 3 Comm, Marconi, and also in Koln, Germany. |
Years: 1996 to 2000 | Country / Region: Singapore, Penang, Kuala Lumpur (Malaysia) | Summary: He provided SMT Manufacturing training to many personnel SE Asia through conferences held in the above countries/cities. |
Years: 1994 to 1994 | Country / Region: Korea | Summary: Samsung. He provided on-site training to Samsung on high-speed digital design. |
Career Accomplishments
Associations / Societies |
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American Society of Test Engineers, SMTA, Society of Automotive Engineers (SAE) |
Professional Appointments |
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Chair of various technical committees at various electronic trade shows (e.g. Nepcon, ATE and Instrumentation Conference, etc.) |
Awards / Recognition |
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Aerospace "Man of the Year" award at Boeing Military Electronics. |
Publications and Patents Summary |
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Two test textbooks plus supplemental texts for all the areas of expertise taught. |
Fields of Expertise
concurrent engineering, fine-pitch technology, surface mount resistor, surface-mount assembly, surface-mount equipment, surface-mount technology, bare board, in-circuit tester, integrated-circuit built-in self test, design for testability, electrical testing, electronics fault testing, electronics testing, boundary scan test, electronics scan testing, built-in self test, computer diagnostic testability measurement, statistical design of experiments, plated through-hole via, quad flat pack, contract manufacturing, small outline integrated circuit, surface mount technology conformal coating, plastic-leaded chip carrier, blind via, time-to-market, printed board assembly, semiconductor flat pack, spring probe, bed-of-nails testing, known good die, integrated-circuit tester, printed wiring assembly, leadless chip carrier, surface-mount technology adhesive, stenciling, chip shooter, analog circuit simulation, electronics reworking, surface-mount printed circuit board, electronics test equipment, design verification testing, vapor-phase reflow soldering, through-hole technology, product testing, rapid product development, high potential dielectric testing, burn-in test, surface-mount component, electronic circuit element testing, surface-mount technology chip carrier, electronics-industry concurrent engineering, electronic-product design for manufacturability, electronics manufacturing automation, surface mount water cleaning, surface-mount solder joint, surface-mount equipment selection, electronics manufacturing quality control, design for manufacturability, design for assembly, surface mount board design, burn-in, new product development, computer-aided integrated-circuit design, computer-aided electric machine design, computer-aided design, computer-aided circuit layout design, computer-aided robotic design, printed-wiring board, printed circuit board soldering, printed circuit board manufacturing, printed circuit board cleaning, printed circuit board, computer-aided manufacturing, computer-aided engineering, very large-scale integration testing, automatic electronics testing, integrated circuit testing, application-specific integrated circuit, automated inspection, high-speed mechanism design, automated machine design, surface-mount cleaning, surface-mount soldering, electronic circuit, factory integration, electronic device, military standard-1553, avionics engineering, soldering material, solder paste, robotics, robot programming, through-hole printed circuit assembly, pick-and-place robot, hybrid microelectronics science, flexible-fixturing technology, factory automation, environmental-stress screening, electronics manufacturing, avionics equipment, manufacturing automation, automatic test equipment