Expert Details

Expert in Design for Test, Test Strategy, SMT Mfg, High-Speed Dig Design & PCB Layout, EMI/EMC, Digital Design

Expert ID: 714785 Washington, USA

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Expert has over thirty year’s experience in the design, manufacturing, and test areas. His initial education was in Industrial Engineering (IE) and Business Administration. After receiving his BSEE/MSEE, where he majored in digital design, computers, and software. Expert became highly involved in all aspects of electronic design and testing. As a digital design engineer, he designed many circuits used in missiles, airplanes, and commercial electronics. He has vast experience working on test-related issues in the laboratory and assembly line troubleshooting and perfecting circuit operation. As an IE he studied and implemented the “Time and Motion Study” Techniques which have culminated in the principles now expressed in the Hitachi and Boothroyd methods for DFA/DFM. He has played a very active role in automating the line, implemented robotics, participated in producibility studies, and automatic material handling. He has held positions responsible for overseeing and working in the CAE/CAD/CAT, JIT, simulation, and automatic material handling. Also, he has performed studies and headed research projects in the Computer Integrated Manufacturing environment, and has been the testability overseer for Boeing Commercial Airline products. Expert is highly involved in high-speed digital design training as well.

Expert has conducted tutorials and workshops at many trade shows, conventions, symposiums, and conferences in the United States and internationally. He has taught various electrical engineering classes at the University of Washington, Washington State University, and Seattle Community College. He has conducted special continuing engineering education classes for the University of Wisconsin, University of California - Berkeley, University of California - Los Angeles, George Washington University, Oregon Graduate Institute of Technology, Oxford University (England), and Seattle Pacific University.

Expert has performed on-site consulting with approximately seventy companies in the United States and internationally. He has taught personnel with virtually all Fortune 500 companies in the U.S.

Among honors Expert has received in industry was Boeing Aerospace Man of the Year Award which he won for consolidating testing techniques for the B1-B program that saved approximately $6,000,000.

He is proficient in several SMT implementation strategies including capital equipment considerations, assembly subcontractor partnerships, component selection and procurement, quality function deployment options, and cost-effective test strategies.

Familiar with in-circuit test fault detection and fault isolation techniques, Expert applies his knowledge to correct manufacturing process problems. He has tested bareboards with blind and buried vias and controlled impedance requirements. He teaches a course entitled "Testing Surface Mount Technology: Practical Bareboard and In-Circuit Strategies" throughout the U.S., Asia, and England.

Expert has expertise in electronics testing. He has extensive experience with through-hole, SMT, commercial, and military electronics. As a test strategist for Boeing, he is very knowledgeable in areas of component, in-circuit, board/system functional, continuity, and robotic testing. He has pioneered areas of built-in self-test, design for testability, and design for productibility. He has also concentrated on SMT test issues.

Expert teaches SCAN techniques at companies and conferences nationwide and is very familiar with IEEE 1149.1 standard. He has designed IEEE 1149.1 boundary scan circuits into ASIC circuitry.

Expert has provided in-plant test-production service to 23 companies, including Ford Motor Company, GE, Solectron, Boeing,

Intel. He conducted High-Speed Digital Design and ABCs of Electronic Technology training at the Intel Folsom, CA Facility.IBM. He conducted High-Speed Digital Design and Advanced High-Speed Digital Design training at the Raleigh, NC facility. AMD. He conducted High-Speed Digital Design, High-Speed Digital Design for Non-EEs, and Advanced High-Speed Digital Design at the Austin TX facility as well as at their facility in Dresden, Germany.Texas Instruments. He conducts high-speed digital design, SMT Manufacturing, SMT Test, EMI/EMC, and Digital Design at the Dallas, TX facility.Freescale Technology. He conducts high-speed digital design at the Novi, MI,, and Austin, TX facilities.

Expert may consult nationally and internationally, and is also local to the following cities: Seattle, Washington - Tacoma, Washington - Bellevue, Washington - Everett, Washington - Federal Way, Washington - Kent, Washington - Bellingham, Washington - Lakewood, Washington - Renton, Washington

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Education

Year Degree Subject Institution
Year: 1966 Degree: MSEE Subject: Institution: Computers & Logic - University of Southern California
Year: 1963 Degree: BSEE Subject: Institution: Electrical Engineering - University of Washington
Year: 1959 Degree: BSBA Subject: Institution: Business Administration - University of North Dakota
Year: 1959 Degree: BSIE Subject: Institution: Industrial Engineering - University of North Dakota

Work History

Years Employer Title Department Responsibilities
Years: 1991 to Present Employer: Undisclosed Title: Electronics/Test Instructor/Consultant Department: Responsibilities: Train and consult in areas of expertise as listed in this bio.
Years: 1988 to 1991 Employer: Principal Engineer, Boeing Aerospace (Commercial AvionicsDivision ) Title: Department: Responsibilities:
Years: 1987 to 1988 Employer: Principal Engineer, Boeing Electronics Company Title: Department: Responsibilities:
Years: 1985 to 1987 Employer: Assistant Manager, Manufacturing Test Engineering, Goodyear Aerospace Title: Department: Responsibilities:
Years: 1982 to 1985 Employer: Project Engineer, Boeing Military Airplane Company Title: Department: Responsibilities:
Years: 1977 to 1982 Employer: Project Engineer, Honeywell Title: Department: Responsibilities:
Years: 1959 to 1977 Employer: Design & Software Engineer, Boeing Aerospace Co. & Rockwell Title: Department: Responsibilities:

Government Experience

Years Agency Role Description
Years: 2004 to Present Agency: NASA Huntsville Role: Instructor Description: Training High-Speed Digital Design and EMI/EMC.
Years: 2006 to 2006 Agency: NASA Dryden Role: Instructor Description: Training High-Speed Digital Design and EMI/EMC.
Years: 2003 to Present Agency: U.S. International Trade Commission Role: Instructor Description: Training ABCs of Electronic Technology and Digital Design
Years: 1987 to Present Agency: Subcontractors for US Govt Role: Instructor/Consultant Description: He trains/consults for government sub-contractors including Boeing, Raytheon, Northup Grumman, DDI, Honeywell, 3M, Loral Aerospace, Martin-Marietta, Lockheed, Rockwell, SRI, TRW.

International Experience

Years Country / Region Summary
Years: 1996 to Present Country / Region: Mexico Summary: He provides training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for the Mexitronica Conference in Guadalajara.
Years: 2001 to 2005 Country / Region: Union of South Africa Summary: He provided training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for the South African engineering community.
Years: 1997 to 2001 Country / Region: United Kingdom and Germany Summary: He provides training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for Oxford University, Xyratex, 3 Comm, Marconi, and also in Koln, Germany.
Years: 1996 to 2000 Country / Region: Singapore, Penang, Kuala Lumpur (Malaysia) Summary: He provided SMT Manufacturing training to many personnel SE Asia through conferences held in the above countries/cities.
Years: 1994 to 1994 Country / Region: Korea Summary: Samsung. He provided on-site training to Samsung on high-speed digital design.

Career Accomplishments

Associations / Societies
American Society of Test Engineers, SMTA, Society of Automotive Engineers (SAE)
Professional Appointments
Chair of various technical committees at various electronic trade shows (e.g. Nepcon, ATE and Instrumentation Conference, etc.)
Awards / Recognition
Aerospace "Man of the Year" award at Boeing Military Electronics.
Publications and Patents Summary
Two test textbooks plus supplemental texts for all the areas of expertise taught.

Fields of Expertise

concurrent engineering, fine-pitch technology, surface mount resistor, surface-mount assembly, surface-mount equipment, surface-mount technology, bare board, in-circuit tester, integrated-circuit built-in self test, design for testability, electrical testing, electronics fault testing, electronics testing, boundary scan test, electronics scan testing, built-in self test, computer diagnostic testability measurement, statistical design of experiments, plated through-hole via, quad flat pack, contract manufacturing, small outline integrated circuit, surface mount technology conformal coating, plastic-leaded chip carrier, blind via, time-to-market, printed board assembly, semiconductor flat pack, spring probe, bed-of-nails testing, known good die, integrated-circuit tester, printed wiring assembly, leadless chip carrier, surface-mount technology adhesive, stenciling, chip shooter, analog circuit simulation, electronics reworking, surface-mount printed circuit board, electronics test equipment, design verification testing, vapor-phase reflow soldering, through-hole technology, product testing, rapid product development, high potential dielectric testing, burn-in test, surface-mount component, electronic circuit element testing, surface-mount technology chip carrier, electronics-industry concurrent engineering, electronic-product design for manufacturability, electronics manufacturing automation, surface mount water cleaning, surface-mount solder joint, surface-mount equipment selection, electronics manufacturing quality control, design for manufacturability, design for assembly, surface mount board design, burn-in, new product development, computer-aided integrated-circuit design, computer-aided electric machine design, computer-aided design, computer-aided circuit layout design, computer-aided robotic design, printed-wiring board, printed circuit board soldering, printed circuit board manufacturing, printed circuit board cleaning, printed circuit board, computer-aided manufacturing, computer-aided engineering, very large-scale integration testing, automatic electronics testing, integrated circuit testing, application-specific integrated circuit, automated inspection, high-speed mechanism design, automated machine design, surface-mount cleaning, surface-mount soldering, electronic circuit, factory integration, electronic device, military standard-1553, avionics engineering, soldering material, solder paste, robotics, robot programming, through-hole printed circuit assembly, pick-and-place robot, hybrid microelectronics science, flexible-fixturing technology, factory automation, environmental-stress screening, electronics manufacturing, avionics equipment, manufacturing automation, automatic test equipment

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