Expert in Electronics Assembly and Manufacturing
Expert ID: 736220 Rhode Island, USA
- Seasoned "Get it Done" (Electronic) Design/Process/Manufacturing Engineer with a proven track record of making a significant impact. Able to flourish in a fast-paced global organization that runs 24/7. Averted customer shutdowns during Thai floods by moving an entire assembly process from one supplier to a competitor in less than one week.
- Extensive new product design and development experience in an Automotive/high reliability/high volume environment. Familiar with modern design tools like Solidworks and Mentor Graphics. Expert at flipchip packaging, and familiar with CMOS wafer fab particularly as it relates to flipchip packaging.
- Experience with all facets of supplier development. Includes surveying and identifying top tier suppliers in the Asian/Pacific Rim area as well as other sites around the globe and managing their activities.
- Several years of Engineering Management experience, including supervision of a team of Process Engineers. Two years of experience supervising a pool of nine Process Engineering Technicians in a union shop environment.
- Well versed in working to AIAG specifications including TS 16949 as well as experience with military standards and specifications, including but not limited to Mil Std 883, Mil Std 1772, Mil M 38510, and Mil M 38534.
- Extensive Customer and Vender contact on a technical level
- Versed in modern DOE techniques. Six Sigma “Green Belt” certified.
- Familiar with all types of electronic assembly processes including; eutectic and epoxy die attach, solder reflow techniques(including SMT) and flip chip assembly, gold and aluminum wire bonding (including large diameter aluminum), and all types of package seal and encapsulation. Experience includes all facets of GaS device assembly.
- “Distinguished Member of the Group technical Staff” of Sensata operating as an “Individual Contributor” with a small group of 5 engineers and 1 technician reporting to me.
- Presented a paper at the national IMAPS 2008 symposium in Providence RI “Flip chip Reliability Improvements for and Automotive Sensor Application”.
- A Team Player able to work well with engineering, manufacturing, and quality in local and global environments as well as front line manufacturing personnel to get the job at hand done.
|Year: 1978||Degree: BS||Subject: Mechanical Engineering||Institution: University of Rhode Island|
|Years: 1997 to 2019||Employer: Sensata Technologies||Title: Distinguished Member Technical Staff- Manager Design Engineer||Department: Design Engineering|
Responsibilities:Manager EMA design group
“Distinguished Member (Formally Texas Instruments) Group Technical Staff”
Duties include overseeing the mechanical design/layout of circuitry (electronic packaging/Electronic Module Assembly (EMA)) used in high reliability, high volume Automotive pressure sensor products. Responsible for implementing best practices and integrating lessons learned. Oversaw and developed a global circuit module development team(6 direct reports, 5 engineers & 1 technician) & strategy that communized designs with respect to tooling, processes, and technology. Responsible for engagement with suppliers and working with them to insure producible high yield designs. Expert at outsourcing and transitioning products to offshore sites. Identified key suppliers for all of our sensor products electronic assemblies in the SE Asia region (global spend in excess of 120 million dollars across several product lines.) Expert at any and all processes related to manufacturing electronic circuits including but not limited to high reliability flip chip assembly, chip and wire assy techniques, and SMT including Pb free. Developed Pb free strategy for our electronic modules. Company wide “go-to” resource for trouble shooting electronic assembly issues as well as analysis of trouble shooting of field returns. Well versed at modern DOE techniques including Taguchi methods. Mentored /trained Asian supplier development team supporting electronics commodities. Interface with customers on new product introduction, supplier audits, and field issues as well as any general electronic assy question that comes up relative to our product.
|Years: 1990 to 1997||Employer: Raytheon||Title: Senior Process Engineer||Department: Process Engineering - Missile Systems Division|
Responsibilities:Duties include Hybrid Microcircuit/MCM production support, responsible for; improving yields, cutting costs, writing process specifications, defining new processes, and general production line trouble shooting. Production product experience not limited to, but including, the following key circuit types; high power custom circuits, DC to DC power converters, high frequency TR modules utilizing GaS devices, and high complexity D type MCMs. Experienced with the latest robotic assembly techniques utilizing MRSI die attach equipment and Hughes/Palomar automatic wire bonders. Formed TQM Manufacturing Quality Team and served as team captain of this team. Brought following processes into full compliance with Mil Std 1772: Solder substrate attach and rework, Eutectic die attach, and large diameter aluminum wire bond. Performed process optimization studies of 1 mil gold wire bond process.
|Years: 1983 to 1990||Employer: Philips Circuit Assemblies||Title: Manager- Process Engineering (last position at this employer)||Department: Enginneering|
Responsibilities:Responsible for managing process engineering department. Directly supervised activities of 3-4 degreed engineers, 4 process technicians, and 2 engineering aides. Managed production support of a high reliability Hybrid production facility consisting of the following product lines; Discreet devices, Thin and Thick Film substrate manufacture, and high and low complexity Hybrid Circuits. Responsible for overseeing the transition of new products from the design concept (schematic and/or layout) to a manufacturable product. Worked closely with design engineering and customers to provide necessary process information and input to assure produce able designs. Provided process inputs for RFQ's from marketing department. Oversaw procurement of capital equipment for manufacturing.
Program Manager (approx 60-70% time)
Copperhead Voltage Regulator Line
Provided Technical Contact for customer on Voltage Regulator line that accounted for in excess of 30% of entire Hybrid gross sales. Oversaw transition to production of this product. Directly supervised production of this product including line supervision, insuring schedules were met, as well as customer quality requirements.
Hybrid Microcircuit production support. Responsible for cutting costs, improving yield introducing and documenting new processes, and all general manufacturing support activities. Performed complete rewrite of all manufacturing process specifications to bring manufacturing area into compliance with Mil Std 1772. Responsible for introducing automated wire bond process. Introduced large diameter aluminum wire bond process and Hydrogen reduction solder reflow process. Provided support to high volume SMT product line.
Fields of Expertise
automotive electronics science, aluminum wire bonding, chip-and-wire, flip-chip assembly, flip chip, microelectronic soldering, chip-on-board technology, chip-to-package interconnection, multichip module, surface-mount technology chip carrier, surface mount board design, surface mount technology conformal coating