Expert Details
Flexible Printed Circuitry, Rigid-Flex Printed Circuitry and Flexible Printed Circuit Materials
ID: 108386
New Hampshire, USA
Expert has worked with process and material development that led to the Zontar process patent, a procedure for manufacturing high-performance, high-yield rigid-flex circuitry using adhesiveless flexible materials and rigid prepregs.
Expert has developed several strip-line flexible circuits, working with design, materials choice, manufacturing technologies, tests, and test fixture design. He is the inventor of the "quilted" configuration for improved flexibility. He also worked on the development and tests for special connectors that control impedance in flexible circuits.
Expert is the inventor, developer, and tester of printed circuit snap-action switches. The process is based on etching a single plane of spring metal, then forming it to create arrays of switches.
After 19 years as a director of research and development, Expert has gained extensive knowledge of product development. He is familiar with exploring and optimizing new ideas for products and methods of manufacture, as well as market research, feasibility, and cost studies. He has worked primarily with electromechanical products, including switches, connectors, and flexible and rigid-flex circuitry.
Evaluation of manufacturing methods and costs for high volume production of medical sensor circuitryAnalyses of materials influence on flexural fatigue failure in printer interconnect circuitry leading to significant improvement in field life.Design and source development for extreme high speed high current test circuitry (semiconductor industry)Design and development of equipment for high volume production of electronic materials by vacuum metalization and roll-to-roll electroplating Research and authoring of presentation to IPC on a new mechanical manufacturing method for producing flex circuitry and "etched heaters."
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1953 | Degree: A.B. | Subject: Physics | Institution: Harvard University |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 1993 to 2003 | Employer: (Undisclosed) | Title: President | Department: |
Responsibilities:Expert is President and founder of the company. |
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| Years | Employer | Title | Department |
| Years: 1991 to 1993 | Employer: Miraco, Inc. | Title: Director of Research & Development | Department: |
Responsibilities:Expert directed process and product development in high-density and custom connectors for flat cable and flexible printed circuitry. He also was responsible for the development of a mechanical process for forming conductor patterns in flex circuitry. |
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| Years | Employer | Title | Department |
| Years: 1988 to 1991 | Employer: Interflex Corp. | Title: Principal Development Engineer | Department: |
Responsibilities:He was responsible for prototype fabrication of unusual flex or rigid-flex circuitry, process/product development, and the management of R&D projects. |
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| Years | Employer | Title | Department |
| Years: 1982 to 1988 | Employer: Advanced Circuit Technology, Inc. | Title: Director of Research & Development | Department: |
Responsibilities:Expert managed R&D, and worked on innovation and development of high-density connectors for flex and flat conductor cabling. |
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| Years | Employer | Title | Department |
| Years: 1977 to 1982 | Employer: Raytheon Co. | Title: Staff Engineer | Department: Missile Systems Division |
Responsibilities:He was an intradivisional expert in electronics interconnections technology. |
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| Years | Employer | Title | Department |
| Years: 1974 to 1977 | Employer: Sanders Associates | Title: Manager of Research & Development | Department: |
Responsibilities:Expert managed R&D projects, and was anAssistant Licensing Manager (for technology transfers). |
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| Years | Employer | Title | Department |
| Years: 1970 to 1974 | Employer: TME Corporation | Title: R&D | Department: |
Responsibilities:He developed manufacturing methods and materials for continuous double-clad flex circuit laminate. |
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International Experience
| Years | Country / Region | Summary |
|---|---|---|
| Years: 1985 to 1988 | Country / Region: United Kingdom | Summary: As Assistant License manager, Expert aided in technology transfer. |
| Years: 1975 to 1975 | Country / Region: Paris, France | Summary: He was involved in technology transfer and appplications engineering. |
| Years: 1994 to 1994 | Country / Region: Echt, Netherlands | Summary: Expert consulted in rigid-flex production technology. |
Career Accomplishments
| Associations / Societies |
|---|
| Expert is a member of NECA (Northeast Circuits Association), IPC, IMAPS, and PHSNE (Photographic Historical Society of New England). |
| Licenses / Certifications |
|---|
| Expert is a USCG licensed Operator. |
| Awards / Recognition |
|---|
| Expert received the IPC Special Recognition Award for promoting and serving the flex circuit industry. |
| Publications and Patents Summary |
|---|
| Expert has 22 patents, and is the author of numerous technical papers published by McGraw-Hill. |
Additional Experience
| Expert Witness Experience |
|---|
| Expert is an expert witness in patent issues (rigid-flex production and explosive valve actuation). |
| Training / Seminars |
|---|
| Expert delivered the following seminars on flex circuit technology: 1-, 2-, and 3-day seminars for IPC at the University of Wisconsin 1-day seminar on applications of flex technology 1/2 day seminar on introduction to rigid-flex |
| Vendor Selection |
|---|
| Expert performed vendor and quality surveys for various employers such as Raytheon, Sanders Associates, ACT, Interflex, and KadFlx. |
| Marketing Experience |
|---|
| He has extensive field and factory experience in applications engineering and product quality resolution. |
| Other Relevant Experience |
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| Expert developed the silver-braze process and a series of "bi-metallic" termination articles that are fused to flexible circuit conductors by means of miniature welding equipment. He also studied the thermo-compression weld process and developed bonding technology with machines, fixtures, and cable choices for automated interconnections in military munitions and fuses. He has worked on a considerable number of engineering applications at customer facilities. |
Fields of Expertise
flexible circuit, flexible circuit design, flexible circuit material, flexible circuit technology, rigid-flex circuit board, flexible circuit impedance control, snap-action switch, electromechanical product development, flex testing, photoetching, flexible printed circuit substrate, wire welding, flexible cable, flexible circuit screen printing, flexible circuit assembly, interconnection technology