Expert Details

Expert in Thermal Management, Electronic Packaging, Mechanical Engineering

Expert ID: 725829 Illinois, USA

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Worked on experimental and numerical simulation in two-phase heat and mass transfer, high-heat-flux cooling, spray, jet, flow boiling, aerospace thermal management, heat pipes, ice accretion, HVAC, turbomachinery, computational fluid dynamics: incompressible and viscous flows with heat transfer, signal processing, computer automation and process control, microchannel cooling, laser diode cooling, cryogenic cooling of RF systems, multi-chip module cooling, thermal and structural analysis, acoustics, vibrations, combustion, coal gasification

Worked on experimental and numerical simulation of flow boiling to evaluate alternative Freon/non-ozone depleting coolants. Data used to upgrade design of nuclear fuel purification facility in PaducahApplied jet impingement using gear lubricant off jet engine to cool coax-VSCF generator power conditioner. Allowed doubling of power within same envelopeDesigned an integrated spray based canister cooler with pump, nozzle, heat sink and condenserVibration sensing for seismic analysis and testing under GR-63 Core and GR-487 Core. Also, high dissipation damper concepts for seismic isolationReduction of operating costs through direct air dual-loop 2-phase cooling module and elimination of air conditioning

Expert may consult nationally and internationally, and is also local to the following cities: Chicago, Illinois - Rockford, Illinois - Aurora, Illinois - Naperville, Illinois - Joliet, Illinois - Elgin, Illinois - South Bend, Indiana - Gary, Indiana - Milwaukee, Wisconsin - Madison, Wisconsin

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Education

Year Degree Subject Institution
Year: 1987 Degree: PhD Subject: Mechanical Engineering Institution: University of Kentucky
Year: 1983 Degree: MSME Subject: Mechanical Engineering Institution: University of Kentucky
Year: 1980 Degree: BSME Subject: Mechanical Engineering Institution: Indian Institute of Technology

Work History

Years Employer Title Department Responsibilities
Years: 1996 to Present Employer: Undisclosed Title: Director Department: Mobile Devices Responsibilities: In this role he is driving the identification and implementation of reach-out technologies with emphasis on structural, thermal, acoustic, vibration, and materials. In addition he is responsible for driving mechanical simulation to enable virtual prototyping, developing and disseminating a simulation process, and enabling key technology components to meet product/customer needs.
Years: 1989 to 1996 Employer: Cudo Technologies Title: President Department: Responsibilities: Founded consulting firm, employed about 11 engineers. Worked on projects in thermal management, HVAC, automation and process control, structural analysis
Years: 1987 to 1996 Employer: University of Kentucky Title: Research Associate Department: Mechanical Engineering Responsibilities: Academics and research in electronic packaging, thermal management

International Experience

Years Country / Region Summary
Years: 2004 to Present Country / Region: Singapore Summary: Directed the creation of electronic packaging architecture for cellular infrastructure products. Created vision for the product line, aligned technologies, and planned road maps
Years: 2007 to Present Country / Region: China Summary: Responsible for driving mechanical simulation to enable virtual prototyping, developing and disseminating a simulation process, and enabling key technology components to meet product/customer needs
Years: 2008 to Present Country / Region: Denmark Summary: Implemented piezo-haptic material characterization; testing and simulation methodologies. Allowed for component level virtual proto-development

Career Accomplishments

Associations / Societies
ASME: American Society of Mechanical Engineers
ASHRAE: American Society of Heating, Refrigeration, and Air-Conditioning Engineers
IWPC: International Wireless Industry Consortium
Licenses / Certifications
Professional Engineer License, KY # 18339, IL # 062-055586
Professional Appointments
Member, Motorola Science Advisory Board
Member, Motorola Patent Committee
Paper Review, Journal of Thermophysics and Heat Transfer
Chair, Plan Commission, Village of North Barrington, Illinois
Publications and Patents Summary
Journal publications 19
Conference papers 46
Technical reports 22
Technical reports Motorola Internal 30
Engineering Awards 2
Patents/pending 11/7
R&D Contracts 24
Bravos 6

Additional Experience

Training / Seminars
Thermal management in electronics
Marketing Experience
Electronic packaging for the telecommunication industry
Other Relevant Experience
• Electronic packaging and associated enabling technologies
• Thermal management
• Acoustics, vibration, seismic, structural (dynamic, static, kinematic)
• Aerodynamics, combustion, fossil fuel technology
• Simulation, analytical and FEA

Language Skills

Language Proficiency
English
Hindi
Italian

Fields of Expertise

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