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ID: 733813
Arizona, USA
Intel CPU PCB Automated Packaging Wafer Laser Saw, Pick and Place, Lid Attach, Laser Mark, Test
Served as Wafer Dicing Pick and Place Process Owner for 25 tool sets, including reflow, wafer tape, dicing saw, laser scribe, die eject, laser mark, coat, flux, solder, heatsink, attach, thermal paste, epoxy, cure, and inline/offline metrology. Vendor training by:…