Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 108175 Indiana, USA

Tribology, Wear, Coatings, Materials Selection, Materials Testing, Computer Modeling, Lubrication

Expert has experience with numerous types of abrasive wear problems, including the design of optimal surface topography to minimize abrasive wear. This includes surface design, wear testing, and the use of coatings in abrasive wear environments to enhance system life…

ID: 717904 Minnesota, USA

Acoustics, Vibration and Sound Quality; Lighting, Daylighting and Vision; Audio and Visual Technology; and Perceptual Research

Expert's thought leadership encompasses the following areas within architecture: Acoustics, Audio and Visual, Daylighting, Lighting, Thermal Comfort, Indoor Air Quality and Occupancy Research. His expertise in Product Development includes Acoustics, Audio and Visual, Lighting and Vision, Thermal Comfort, Consumer Research,…

ID: 715472 Minnesota, USA

Product-Market Interface

Expert NPDP is a certified product developer offering seminars and unique knowledge exchange services for product development managers desiring to learn and implement the four elements of the Toyota Lean Design product development system. Expert also offers Lead User methodology…

ID: 108416 Massachusetts, USA

Robust Design, Quality Systems Design, Key Characteristics, Six Sigma, etc.

DESIGN ENGINEERING; PRODUCT DEVELOPMENT. Expert does research and consulting work to help companies improve their product development process. She has worked with several US design and manufacturing companies including ITT, Kodak, Chrysler, HP, Boeing, Polaroid, GM, Teradyne, and Ford. Her…

ID: 712047 New Jersey, USA

Microcontroller-based Product Design

Most of the projects expert has been involved with have been real-time dependent. He has designed high-speed bit-slice-based data acquisition units for military aircraft radar, high-speed machinery controls, home automation, cordless telephones, fitness equipment, arcade games, and other consumer products.…

ID: 717458 New Jersey, USA

Laboratory Management; Quality Assurance/Control

Expert has demonstrated expertise with the design, development, and start-up of laboratory facilities. These facilities have been used for analytical testing, physical characterization, environmental sample conditioning, and drug stability testing. He has specified and implemented purified water systems, sample conditioning…

ID: 107788 Wisconsin, USA

Internet, Hypertext Languages

INTERNET. Expert has developed and maintains a list of Internet resources related to the field of computer-mediated communication (CMC). He has created techniques for formatting, designing, and presenting this information in multiple text and hypertext formats. His resource database includes…

ID: 107751 New York, USA

Polymer Foam Process & Materials

Expert is an Adjunct Professor in the Packaging Science Department at the Rochester Institute of Technology where he teaches plastics processing and research methods. He has extensive experience with the extrusion and thermoforming of cellular plastics, especially polystyrene foam. He…

ID: 108426 Colorado, USA

Plastic Molding Processes

Expert has extensive experience with plastic molding processes and with injection molding in particular. He is often called upon to help clients with issues such as injection molding machine selection, injection mold lubrication, and in-mold labeling. He has been responsible…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

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