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Semiconductor Packaging, SMT, Flip Chip and WLCSP Assembly, Failure Analysis, Advanced Packaging Substrates, Printed Circuit Boards, Product Development
Advanced Semiconductor Packaging, Expert Witness & Technology Due Diligence, Technology Investment Advising Dynamic Senior Engineering Manager with more than 15 years of International Semiconductor Packaging development and high-volume manufacturing of advanced IC packages for mobile, automotive and medical end applications.…
Semiconductor Industry Technology, IC Process & Manufacturing, HW Systems Specialist with Patents
Expert is a Board of Director/Technical Advisor in several start-up Technology firms. As Chief Technical Advisor to a Venture/PE fund, he evaluated several Technology companies in the areas of Software, Semiconductor and System HW. He is also associated as the…
Motion Sensors, Occupancy Sensors, Passive Infrared, Analog, Digital, Electronics & Proposals
Degreed, self-starting Electrical Engineer (BEE) who specializes in digital and analog circuit and system design and hardware, firmware, and software development. Skilled in the design, invention, and innovation of high technology security electronics. Extensive background in digital circuitry enhanced with…
Packaging Machinery, Automatic Cartoning, Casepacking
He is familiar with the latest in vision technology, progammable logic controllers, servo motors and drives from all the large vendors such as Allen Bradley, Automation Direct, Emerson and Toshiba and how they relate to specific tasks in automation as…
Machine Vision, Sensors, Analog & Digital Design, Communications
The circuit design approach that the expert uses begins with a system level point of view. He develops a detailed specification for circuit requirements in the context of the over all product. This allows him to optimize its partition among…
Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert has Ph.D. in analyzing interconnection technologies, including…
RFID, Operations Management, R&D Strategy, Project Management, Supply Chain & Logistics
Expert R. Expert was a pioneer in the "surface mount revolution" where he developed packaging, interconnect, process, and design technologies to enable high volume, small footprint manufacturing of two-way radios, cellphones, and pagers. He has led green field factory development…
Microcontroller-based Product Design
Most of the projects expert has been involved with have been real-time dependent. He has designed high-speed bit-slice-based data acquisition units for military aircraft radar, high-speed machinery controls, home automation, cordless telephones, fitness equipment, arcade games, and other consumer products.…
Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. He is familiar with materials, component packages, and the related…
Vacuum Processes, Optical Multilayer Thin Films, Ophthalmic Lenses, Photochromic Dyes, Diamond film
THIN FILM, HIGH VACUUM, THIN-FILM DEPOSITION PROCESS. Expert has expertise in many aspects of thin film deposition processes including physical vapor deposition, rf and dc magnetron sputtering, ion beam sputtering, ion-assisted deposition, and chemical vapor deposition (CVD). He developed an…