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Semiconductor Packaging, SMT, Flip Chip and WLCSP Assembly, Failure Analysis, Advanced Packaging Substrates, Printed Circuit Boards, Product Development
Advanced Semiconductor Packaging, Expert Witness & Technology Due Diligence, Technology Investment Advising Dynamic Senior Engineering Manager with more than 15 years of International Semiconductor Packaging development and high-volume manufacturing of advanced IC packages for mobile, automotive and medical end applications.…
Semiconductor Technology and Microelectronics
Expert has microelectronics development, fabrication, manufacturing and intellectual property expertise acquired over a successful hands-on career spanning more than 3 decades, and covering CMOS semiconductor device technology nodes from 1um down to 14nm (current). His experience is both in-depth and…
Energy Efficiency and Carbon Reduction Management
Expert provides specialist Energy Efficiency and Carbon Management Services to private and public sector organisations throughout the UK. Expert is a multi-disciplinary engineering consultant and undertakes all aspects of energy related works to identify consumption, carbon and cost saving opportunities.…
LED technology: MOCVD, Fab, packaging, optics, integration, solid-state lighting
Expert has worked with LED technology for over 23 years and have direct experience in both R&D and manufacturing environments related to MCOVD growth, LED fabrication, LED die testing and reliability, LED package design (optical and thermal) and integration into…
Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. He is familiar with materials, component packages, and the related…