Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 722203 Illinois, USA

Nondestructive Testing and Evaluation; Machine and Structural Design

Expert has been at (Undisclosed) where he currently is a professor in the Department of General Engineering. Expert is also Director of the Nondestructive Testing and Evaluation Research Laboratory. The Laboratory supports research work in ultrasonics (immersion, air-coupled, and water-squirt),…

ID: 107791 Illinois, USA

Fasteners

Expert offers consulting services to hardware manufacturers, distributors, and OEM users on issues related to engineering, design, application, training, and sales of threaded fasteners, lock nuts, and machined and cold-headed parts. He is a member of the editorial staff of…

ID: 108506 Tennessee, USA

Surface Mount Technology

Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. He is familiar with materials, component packages, and the related…

ID: 108206 New Zealand

Polymer Selection for Food, Automotive, and Electronic Markets

Expert has an in-depth understanding of the high-pressure synthesis copolymerization of ethylene with combinations of co-monomers such as acrylates, vinyl acetate, (meth)acrylic acid, and carbon monoxide. His knowledge results from the high-pressure pilot plant work performed under his direction to…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

ID: 108261 North Carolina, USA

Recognition Systems, Imaging, Check Imaging

Expert has expertise in document imaging. He managed the development of the world's highest throughput image system for bank check capture, processing, storage, retrieval, character recognition, magnetic character encoding, and image statement printing. He is highly knowledgeable of applying image…

ID: 711984 California, USA

CFC Alternatives, Electronics; Circuit Board; Circuit Board Solvents; Chlorofluorocarbon

Expert was responsible for developing and evaluating new products for their ability to substitute for CFC-113 solvents in electronics defluxing and industrial cleaning applications. He directed and managed the testing of two products for the IPC/DoD/EPA Phase 2 Test; both…

ID: 108290 Wisconsin, USA

Fatigue, Spate Methods, NDE, Product Liability, Thermomechanics, etc.

LIFE PREDICTION METHODOLOGIES FOR COMPONENTS OF STRUCTURES, MACHINES, AND ELECTRONIC DEVICES. Expert's work centers on life prediction methodologies for components of structures, machines, and electronic devices. The major parameters of interest are stress, strain, time, temperature, and damage. These quantities…

ID: 108190 Massachusetts, USA

Powdered Metals & P/M Products

Expert has founded and operated businesses that produce powdered metal parts. He is the co-founder and President of his organization. The development of metals and alloys has been the focus of his career. He understands thoroughly the manufacturing process that…

ID: 717532 New York, USA

Surface Mount Technology (SMT) and High-Technology Light Sources, Turnkey Operations, etc.

Expert has devoted a significant portion of his career to the development of Surface Mount Technology (SMT) devices, equipment, and processes. These include: placement, cleaning, solder reflow equipment, components, component design, component packaging for automatic placement, and processing of the…

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