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Expert's entire career has been devoted to developing, introducing, and managing advanced circuit board technology, including activities within the circuit board design environment. He is currently introducing 0.008 inch, 0.006 inch, and 0.003 inch laser drilling processes into the domestic circuit board industry. Several circuit board fabricators are certified to produce these laser-drilled circuit boards. Expert has been referenced as the person who first attempted to commercialize laser drilling blind vias. In 1986, in collaboration with a major laser systems manufacturer, he founded a company (Interconnect Technology Inc.) that focused on complete turn-key manufacturing, including design, laser drilled blind via fabrication, and surface mount assembly. Since 1988, he has built five laser systems, and licensed laser drilling technology on an R&D basis to Sandia National Laboratories. Expert has been awarded a new patent method for producing variable depth or multi-depth blind microvia laser drilling, including a new laser system and the resulting circuit board. He is currently working to commercialize these new cost-effective enabling microvia technologies and the laser system.

Expert is introducing the ability, through laser drilling, small blind microvias (sometimes called micro hole drilling) within surface mount pads. These blind vias relieve the circuit design problem of "via starvation". This allows 10 to 8 layer circuit boards to be reduced to 6 to 4 layers, while improving the placement (density) of fine pitch components.

Two and Three mil (0.002 in & 0.003 in.) diameter blind microvias are in final development and about to be introduced to the circuit board industry fabricators as producers of polymer substrates for MCM-L, FLIP CHIP and COB users. Expert has been working with design systems for the design of "chip on-board" (COB) technology, specifically relating to laser drilled blind microvia technology interconnections.