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Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…
Vacuum Processes, Optical Multilayer Thin Films, Ophthalmic Lenses, Photochromic Dyes, Diamond film
THIN FILM, HIGH VACUUM, THIN-FILM DEPOSITION PROCESS. Expert has expertise in many aspects of thin film deposition processes including physical vapor deposition, rf and dc magnetron sputtering, ion beam sputtering, ion-assisted deposition, and chemical vapor deposition (CVD). He developed an…
Integrated Business/Technology Planning, Strategic Planning, Small/Medium Business Analysis
Expert has a deep understanding of virtually all aspects of business development, including customer needs; operations efficiency and effectiveness. He has provided advice and counsel for numerous small businesses and has managed in-depth studies of telecommunications and information handling requirements…
Food Technology, Product Development/Optimization, Food Quality, Anti-oxidants, Sensory, Consumer
Expert is internationally recognized for her expertise in sensory evaluation of food products and associated packaging. She heads the sensory evaluation program at the Employer, which is ranked among the top five sensory science programs in the country. As a…
Wastewater & Permits, Electro/Electroless/Semiconductor Plating Processes, Water Recycle
Expert has 25 years of R&D, technical service, and consulting experience in most areas of electroless plating, electrolytic plating, and printed circuit board plating. He owns his own consulting and contract R&D firm, which has numerous U.S. patents. A certified…
Microvias, Blind Microvia Laser Drilling, Circuit Board Fabrication
Expert's entire career has been devoted to developing, introducing, and managing advanced circuit board technology, including activities within the circuit board design environment. He is currently introducing 0.008 inch, 0.006 inch, and 0.003 inch laser drilling processes into the domestic…