Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 723568 California, USA

Optical Instruments, Inertial Instruments, Laser and Fiber Optic Gyros, Thin Film Coating

Over 41 years of experience in fiber optics sensors and fiber optic devices for telecommunication networks. The experience includes all phases of product development from conceptual design to prototyping, design-to-cost, production planning, and transition to production. Has nine patents and…

ID: 723560 California, USA

Semiconductor Industry IC Package Design and Development, Consulting and Training

Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert has Ph.D. in analyzing interconnection technologies, including…

ID: 723539 Canada

Engineering and Physics of Photonics and Electronics Technology

A major part of his career has been engaged in the technology of compound semiconductors, especially from the III-V family of semiconductors (using elements from group III and group V of the periodic table), which are of great interest for…

ID: 723388 California, USA

Display Materials, Lamp Materials, Electronic Materials (Powders, Thin Films, Nano) and Solar Cells

Expert is a multidiscipliarian managing development & commercialisation from start-ups to sales in electronic displays, lamps & electronic materials. He has spent nearly a decade developing hot, cold & sintered cathodes for gas discharge lamps including use in signage, automotive…

ID: 723277 India

Polymeric Flooring: Coatings, Repairs and Maintenance

Expert has over 20 years of experience in the industry. He can handle consultancy services of technical execution of epoxy /PU flooring, coating, repairs and maintenance, as well as Civil Engineering applications. He is responsible for raw material selection; design…

ID: 722631 California, USA

Mechanical Engineering Design and Analysis

Expert has more than 30 years of experience in providing mechanical engineering support to electronic and LASER products for military and commercial applications. He has performed in engineering, program, and supervisory roles including design, analysis, budgets, scheduling, manufacturing support, field…

ID: 722339 Delaware, USA

Thin Film Solar Cell Testing; Semiconductor Optoelectronic Device Measurement and Analysis

Expert has been involved in research and development of amorphous silicon (a-Si) thin film solar cells for 20 years; in this time he has authored or co-authored over 30 papers. He has guided the optimization of device performance from three…

ID: 108201 Indiana, USA

Fastening to Aluminum, Plastic, and Other Soft Material, TaptiteĀ® Applications, Torque, Boss, etc.

Expert has extensive experience with a variety of threaded fasteners. He has worked with design engineers to develop the proper selection of fasteners, to determine assembly strategies, and to diagnose assembly problems for a whole range of products. He has…

ID: 712047 New Jersey, USA

Microcontroller-based Product Design

Most of the projects expert has been involved with have been real-time dependent. He has designed high-speed bit-slice-based data acquisition units for military aircraft radar, high-speed machinery controls, home automation, cordless telephones, fitness equipment, arcade games, and other consumer products.…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

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