Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 726009 Massachusetts, USA

Analog IC Design, Mixed-signal IC Design, Off-shore Engineering, High-Speed Interfaces

Electronics engineering professional with over twenty-five years experience. Various individual contributor, technical leadership and management roles were performed including integrated circuit and system design, engineering management, business development, marketing management and research management primarily in the analog/mixed-signal design field. Major…

ID: 725847 Texas, USA

Low Power Chip Design, Verification, DSP, and Algorithms

He has worked with design and validation of popular bus arhcitectures and protocls such as AMBA and PCI. He has worked with design an development of Microprocessors and Texas Instruments Digital Signal Processors. He has worked as designer on x86…

ID: 725326 California, USA

Semiconductor Packaging and Assembly, Systems Engineering, and Materials Science.

Expert has designed a digital press having the lithographic performance of photo gravure, but able to stream continuous data for variable printing. The performance includes 2400 dpi resolution, 200 fpm web speed, and 48-inch wide print dimension. The press has…

ID: 725037 Minnesota, USA

Development and Assurance of High-Assurance / Safety-Critical Software & Embedded Systems

Expert has substantial experience with software safety and reliability. Most of his career has been spent working with high-assurance systems and safety-critical software. He has developed software for commercial aviation systems, for medical devices, and for industrial controls and safety…

ID: 724318 New Hampshire, USA

Machine Vision, Sensors, Analog & Digital Design, Communications

The circuit design approach that the expert uses begins with a system level point of view. He develops a detailed specification for circuit requirements in the context of the over all product. This allows him to optimize its partition among…

ID: 724290 California, USA

Electronic and Mechanical Device Reliability, Failure Analysis, Risk and Safety Assessment

Expert is an expert in the fields of reliability, risk, and safety assessment. He performs electronic and mechanical device reliability analysis, failure analysis, failure modes and effects analysis, and fault tree analysis. Expert is an expert in the fields of…

ID: 724211 California, USA

Radiation Effects on Electronics, Single Event & Gamma Effects (SEE), and Test and Analysis Services

Expert has momentous years of experience in the assessment of space electronics systems to single event effects (SEE) and nuclear transient radiation effects. This includes single event upset, latchup and gate rupture. He also has an extensive history working in…

ID: 723539 Canada

Engineering and Physics of Photonics and Electronics Technology

A major part of his career has been engaged in the technology of compound semiconductors, especially from the III-V family of semiconductors (using elements from group III and group V of the periodic table), which are of great interest for…

ID: 712047 New Jersey, USA

Microcontroller-based Product Design

Most of the projects expert has been involved with have been real-time dependent. He has designed high-speed bit-slice-based data acquisition units for military aircraft radar, high-speed machinery controls, home automation, cordless telephones, fitness equipment, arcade games, and other consumer products.…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

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