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Expert ID: 735143 Arizona, USA

Expert in Semiconductor Packaging, SMT, Flip Chip and WLCSP Assembly, Failure Analysis, Advanced Packaging Substrates, Printed Circuit Boards, Product Development

Advanced Semiconductor Packaging, Expert Witness & Technology Due Diligence, Technology Investment Advising Dynamic Senior Engineering Manager with more than 15 years of International Semiconductor Packaging development and high-volume manufacturing of advanced IC packages for mobile, automotive and medical end applications.…

Expert ID: 733514 California, USA

Expert in Intellectual Property (Patent, Trademark, Copyright), Breach of Contract, & Royalty Audit Financial Damage Calculations

Economic Damages Expert Witness, Royalty Audit, Fraud, & Forensics Expert is experienced as an economic damages expert in State, Federal and USITC matters. In additional to economic damages and lost profits, Expert serves as an expert related to royalty audits…

Expert ID: 732366 Vermont, USA

Expert in Semiconductor Technology and Microelectronics

Expert has microelectronics development, fabrication, manufacturing and intellectual property expertise acquired over a successful hands-on career spanning more than 3 decades, and covering CMOS semiconductor device technology nodes from 1um down to 14nm (current). His experience is both in-depth and…

Expert ID: 727218 Minnesota, USA

Expert in Semiconductor Yield, Metal & Material Failure Analysis, Comprehensive Root Cause Analysis

Expert has performed over 200 failure analysis reports on semiconductor integrated circuit failures, metal component failures and machinery failures. Expert has the abilities to go deep in engineering and science and obtain the most likely root cause amoung the myriads…

Expert ID: 727044 New York, USA

Expert in Semiconductor Assembly and General Technology Management

Expert has worked in Assembly Technology since 1977 at such leading companies as Intel and Orient Semiconductor. During the last 30 years, he has amassed a great deal of hands on experience with the interaction of the wafer fabrication process…

Expert ID: 725326 California, USA

Expert in Semiconductor Packaging and Assembly, Systems Engineering, and Materials Science.

Expert has designed a digital press having the lithographic performance of photo gravure, but able to stream continuous data for variable printing. The performance includes 2400 dpi resolution, 200 fpm web speed, and 48-inch wide print dimension. The press has…

Expert ID: 724157 Illinois, USA

Expert in Thin Film Deposition, Chemical Mechanical Polishing, Semiconductor Process Integration

Expert has 10 years of experience developing consumable products and processes for application in chemical mechanical polishing. He holds approximately ten patents and patent applications on consumables and processes for chemical mechanical polishing. The expert has intimate knowledge of chemical…

Expert ID: 723210 California, USA

Expert in Advanced Semiconductor Lithography

Expert has worked in electron beam lithography research and application since graduate school. Specifically he developed new pattern generation techniques for improved throughput and accuracy. He also developed a new generation of electron beam mask writer. His work on the…

Expert ID: 108231 Washington, USA

Expert in Semiconductor Technology

Since 1960, Expert (pronounced rye-chowdree) has made extensive contributions to materials and semiconductor technology. During his early years with Westinghouse, he conducted pioneering work in the areas of silicon epitaxy, selective epitaxy, and polysilicon. He has made significant contributions in…

Expert ID: 716795 Connecticut, USA

Expert in Semiconductor Device Process

Electronic Device Reliability; Semiconductor Device Reliability A major focus of Expert's research over the past two decades has been on the reliability issues in semiconductor devices; in particular, high-field effects, hot-carrier effects, and ionizing radiation effects. His research in this…

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