Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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ID: 725037 Minnesota, USA

Development and Assurance of High-Assurance / Safety-Critical Software & Embedded Systems

Expert has substantial experience with software safety and reliability. Most of his career has been spent working with high-assurance systems and safety-critical software. He has developed software for commercial aviation systems, for medical devices, and for industrial controls and safety…

ID: 724336 California, USA

Radio Frequency / Analog / Mixed-Signal Integrated Circuit Design. Wireless Communications.

Expert has designed Radio Frequency/ Analog/Mixed-Signal integrated circuits for over 21 years. He has successfully lead projects and designed products from concepts to mass production in the wireless and hard disk drives industries. He has design integrated circuits in CMOS/BiCMOS/Bipolar…

ID: 724318 New Hampshire, USA

Machine Vision, Sensors, Analog & Digital Design, Communications

The circuit design approach that the expert uses begins with a system level point of view. He develops a detailed specification for circuit requirements in the context of the over all product. This allows him to optimize its partition among…

ID: 723991 California, USA

Mechanics (Stress, Dynamics, Test), Modeling (FEA, CFD, Chemical), Machine Design, Controls

At Cessna, Expert designed the pressure cabin, empennage, and main spar carry through for the 441 Conquest and 650 Citation 2. His other engineering responsibilities included stress measurement (strain gauges, brittle coatings), solids modeling (NASTRAN), and FAA certification report authoring.…

ID: 723857 Minnesota, USA

Optical Instrumentation Design, 3D Imaging, Confocal Microscopy, OCT, FTIR, Laser Scanning

Expert in the design and function of confocal microscope systems. Holder several patents for original confocal systems designed the semiconductor, glass, and other industries. Expert in 3D imaging technologies including laser triangulation, moiré', confocal imaging, and interferometry. Expert has designed…

ID: 723854 California, USA

RF, Wireless, Microwave, Analog, Digital and Video System and Design Engineering

Expert is an RF/Microwave Engineering Consultant with 33 years of experience in the areas of RF, Microwave, Wireless, Analog, and high-speed Digital/FPGA designs. Expert recently completed a Patent Research project on an ITC Section 337 lawsuit that involved a number…

ID: 722587 India

Heat Transfer, Heat Pipes, Cooling Systems, Power Plant Equipment Design, New Product Development

Expert’s interests and experience extend over a wide range of air-cooled heat exchangers. Prompted mainly by the present day environmental concerns and scarce water resources, as well as by the more attractive maintenance-free operation of air-cooled units compared to water-cooled…

ID: 718005 Massachusetts, USA

Materials and Controls

As the former Vice President of Materials and Controls at Texas Instruments, Expert has diversified experience in electronics corrosion prevention, metallurgy, and electronic ceramics and thermostatic bimetal discs. He led the development of unique processes for titanium aluminide thin foil…

ID: 108456 Delaware, USA

Imaging Systems, New Products

Expert has applied his experience in research and development and new business development to technology planning and management in many fields, especially those related to the electronics, medical imaging, and printing industries. Using a broad range of strategic planning tools,…

ID: 108191 Maryland, USA

Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this…

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